THERMALLY CONDUCTIVE STRUCTURE FOR DISSIPATING HEAT IN A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20190082555A1

    公开(公告)日:2019-03-14

    申请号:US16127043

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

    PORTABLE ELECTRONIC DEVICE
    2.
    发明申请

    公开(公告)号:US20200310489A1

    公开(公告)日:2020-10-01

    申请号:US16586726

    申请日:2019-09-27

    Applicant: Apple Inc.

    Abstract: According to some embodiments, a portable electronic device is described. The portable electronic device includes a housing having side walls and a back wall that define a cavity, where the back wall includes (i) a first section having a first exterior surface, and (ii) a second section having a second exterior surface that is parallel to and vertically displaced from the first exterior surface. The portable electronic device further includes a brace structure joined to the back wall, a trim structure welded to the brace structure, where the trim structure has an external surface that is vertically displaced from the second exterior surface, and a camera module disposed within the cavity and carried by the brace structure.

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