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公开(公告)号：US20200076056A1
公开(公告)日：2020-03-05
申请号：US16142285
申请日：2018-09-26
Applicant: Apple Inc.
Inventor： Kevin M. Froese , Paul U. Leutheuser , Martin J. Auclair , Christopher J. Durning , Jun Ham , Lucy E. Browning , Sawyer I. Cohen , Richard Hung Minh Dinh , Donald J. Parr
Abstract: A device includes a display and a housing. The housing surrounds the display and has four corners defining portions of an exterior surface of the device. The housing includes a first housing segment defining at least part of a first corner of the four corners and configured to operate as an antenna; a second housing segment defining at least part of a second corner of the four corners; and a third housing segment defining at least part of a third corner of the four corners. The third corner forms part of the housing diagonally opposite the second corner. The housing further includes a non-conductive housing component that structurally couples the first housing segment to another portion of the housing.
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公开(公告)号：US10184190B2
公开(公告)日：2019-01-22
申请号：US14622443
申请日：2015-02-13
Applicant: Apple Inc.
Inventor： Lucy E. Browning , Stephen B. Lynch , Christopher D. Prest , Peter N. Russell-Clarke , Masashige Tatebe , Michael S. Nashner , Daniel T. McDonald , Brian S. Tryon , Jody R. Akana
IPC: C25D11/18 , B23K26/354 , B23K26/352 , C25D11/04 , C25D11/12 , C25D11/02
Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.
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公开(公告)号：US20150176146A1
公开(公告)日：2015-06-25
申请号：US14622443
申请日：2015-02-13
Applicant: APPLE INC.
Inventor： Lucy E. Browning , Stephen B. Lynch , Christopher D. Prest , Peter N. Russell-Clarke , Masashige Tatebe , Michael S. Nashner , Daniel T. McDonald , Brian S. Tryon , Jody R. Akana
IPC: C25D11/18
CPC classification number: C25D11/18 , B23K26/354 , B23K26/355 , C25D11/024 , C25D11/04 , C25D11/045 , C25D11/12 , Y10T428/13 , Y10T428/24331 , Y10T428/24471
Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.
Abstract translation: 本文所述的实施例涉及形成具有白色外观的阳极氧化膜。 在一些实施例中，描述了通过在阳极氧化处理期间改变电流密度而产生具有光扩散孔壁的孔的阳极化膜。 在一些实施例中，描述了通过激光破裂程序产生的具有光扩散微裂纹的阳极氧化膜。 在一些实施例中，在阳极氧化膜的下方提供光扩散铝的溅射层。 在一些实施例中，光漫射颗粒注入阳极氧化层的开口内。
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公开(公告)号：USD1048028S1
公开(公告)日：2024-10-22
申请号：US29833187
申请日：2022-04-01
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Lucy E. Browning , Abidur Rahman Chowdhury , Clara Geneviève Marine Courtaigne , Markus Diebel , Richard Hung Minh Dinh , Jonathan Gomez Garcia , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , Peter Russell-Clarke , Benjamin Andrew Shaffer , Sung-Ho Tan , Clement Tissandier , Eugene Antony Whang , Luman Zhang , Xiao Ying Zhao , Rico Zörkendörfer
Abstract: FIG. 1 is a bottom and front perspective view of a housing module for an electronic device showing the claimed design;
FIG. 2 is a top and rear perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.-
公开(公告)号：US11955696B2
公开(公告)日：2024-04-09
申请号：US17480255
申请日：2021-09-21
Applicant: Apple Inc.
Inventor： Kevin M. Froese , Paul U. Leutheuser , Martin J. Auclair , Christopher J. Durning , Jun Ham , Lucy E. Browning , Sawyer I. Cohen , Richard Hung Minh Dinh , Donald J. Parr
CPC classification number: H01Q1/243 , H01Q5/30 , H04M1/0283 , H05K5/0017 , H05K5/0208 , H05K5/0217
Abstract: A device includes a display and a housing. The housing surrounds the display and has four corners defining portions of an exterior surface of the device. The housing includes a first housing segment defining at least part of a first corner of the four corners and configured to operate as an antenna; a second housing segment defining at least part of a second corner of the four corners; and a third housing segment defining at least part of a third corner of the four corners. The third corner forms part of the housing diagonally opposite the second corner. The housing further includes a non-conductive housing component that structurally couples the first housing segment to another portion of the housing.
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Patent Agency Ranking
公开(公告)号：US11630537B2
公开(公告)日：2023-04-18
申请号：US17558103
申请日：2021-12-21
Applicant: Apple Inc.
Inventor： Michael B. Wittenberg , Daniel J. Barrett , Erik G. de Jong , Lucy E. Browning , Marwan Rammah , Rasamy Phouthavong , Sameer Pandya
Abstract: An electronic device may have light-emitting devices. A light-emitting device may include light-emitting diodes, a display, or other components that emit visual output. One or more image transport layers may be included in the electronic device. An image transport layer may have an input surface that receives an image and an output surface to which the image transport layer transports the image for viewing by a user. The image transport layers may have areas with compound curvature and other shapes. Deformed image transport layer structures such as deformed fibers in a coherent fiber bundle may be configured to hide gaps in displays and other structures. Displays may include light detectors that serve as a two-dimensional touch sensor. The touch sensor may detect touch input on an output surface of an image transport layer. Image transport layer material may be incorporated into buttons, elongated housings, wearable devices, and other equipment.
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公开(公告)号：US11505131B2
公开(公告)日：2022-11-22
申请号：US16871918
申请日：2020-05-11
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Stephen P. Zadesky , Trent Weber , Lucy E. Browning
IPC: B60R7/04 , A45C11/00 , B60R11/02 , G06F1/18 , H01L23/043 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10 , H05K5/00 , H05K13/00 , G06F1/16 , H05K5/02 , H05K5/04 , H05K5/06 , B60R11/00
Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
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公开(公告)号：USD951958S1
公开(公告)日：2022-05-17
申请号：US29714461
申请日：2019-11-22
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Lucy E. Browning , Abidur Rahman Chowdhury , Clara Geneviève Marine Courtaigne , Markus Diebel , Richard Hung Minh Dinh , Jonathan Gomez Garcia , Jun Sik Ham , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , Peter Russell-Clarke , Benjamin Andrew Shaffer , Sung-Ho Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD938955S1
公开(公告)日：2021-12-21
申请号：US29714460
申请日：2019-11-22
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Lucy E. Browning , Abidur Rahman Chowdhury , Clara Geneviève Marine Courtaigne , Markus Diebel , Richard Hung Minh Dinh , Christopher E. Glazowski , Jonathan Gomez Garcia , Jean-Pierre S. Guillou , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , Peter Russell-Clarke , Benjamin Andrew Shaffer , Sung-Ho Tan , Clement Tissandier , Eugene Antony Whang , Yaocheng Zhang , Rico Zörkendörfer
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公开(公告)号：US20210168226A1
公开(公告)日：2021-06-03
申请号：US17068619
申请日：2020-10-12
Applicant: Apple Inc.
Inventor： Bryan D. Keen , Devon A. Monaco , Sherry Lee , Ihtesham H. Chowdhury , Eric N. Nyland , Matthew D. Hill , Arun R. Varma , Lucy E. Browning , Sawyer I. Cohen , Benjamin J. Pope
Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.
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