公开(公告)号：US20250112075A1

公开(公告)日：2025-04-03

申请号：US18375339

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Joseph F. SOMMERS ,  Joseph F. BEHNKE ,  Sajad YAZDANI ,  Xue CHANG ,  Kartik RAMASWAMY ,  Tomoaki KOHZU ,  Kyounghwan NA

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by a metal bond layer. The substrate support assembly includes a blocking ring disposed around the metal bond layer.

公开(公告)号：US20230118651A1

公开(公告)日：2023-04-20

申请号：US17823702

申请日：2022-08-31

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Jaeyong CHO ,  Alexander SULYMAN ,  Xue CHANG ,  Kartik RAMASWAMY ,  Steven E. BABAYAN ,  Anwar HUSAIN ,  David COUMOU

IPC: H01J37/32 ,  H01L21/683

Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.

公开(公告)号：US20210296144A1

公开(公告)日：2021-09-23

申请号：US17332458

申请日：2021-05-27

Applicant: Applied Materials, Inc.

Inventor： Xing LIN ,  Vijay D. PARKHE ,  Jianhua ZHOU ,  Edward P. HAMMOND, IV ,  Jaeyong CHO ,  Zheng John YE ,  Zonghui SU ,  Juan Carlos ROCHA-ALVAREZ

IPC: H01L21/67 ,  C23C16/46 ,  C23C14/50 ,  H01J37/32 ,  H01L21/687 ,  C23C16/509 ,  C23C16/458

Abstract: A method and apparatus for a heated substrate support pedestal is provided. In one embodiment, a substrate support pedestal includes a ceramic body having a top surface and a bottom surface. The substrate support pedestal has a stem coupled to the bottom surface of the ceramic body. A top electrode is disposed within the ceramic body. A conductive rod is disposed through the stem and coupled to the top electrode. A plurality of heater elements is disposed within the ceramic body below the top electrode. A ground mesh is disposed within the ceramic body, below the plurality of heater elements, and above the bottom surface of the ceramic body.