公开(公告)号：US20190206712A1

公开(公告)日：2019-07-04

申请号：US16293437

申请日：2019-03-05

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Jim Zhongyi HE ,  Ramesh GOPALAN ,  Robert T. HIRAHARA ,  Govinda RAJ

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6831 ,  H01J37/32091 ,  H01J37/32449 ,  H01J37/32715

Abstract: Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.