公开(公告)号：US20210175189A1

公开(公告)日：2021-06-10

申请号：US16703409

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Chang-Yu LIN

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/64 ,  H01L21/56

Abstract: A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.

公开(公告)号：US20200212023A1

公开(公告)日：2020-07-02

申请号：US16236186

申请日：2018-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Chieh-Chen FU

IPC: H01L25/16 ,  H01L33/52 ,  H01L33/58 ,  H01L23/538

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.