公开(公告)号：US20210167053A1

公开(公告)日：2021-06-03

申请号：US17170666

申请日：2021-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Chieh-Chen FU

IPC: H01L25/16 ,  H01L33/52 ,  H01L23/538 ,  H01L33/58

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US20240113061A1

公开(公告)日：2024-04-04

申请号：US18530123

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20230006114A1

公开(公告)日：2023-01-05

申请号：US17367052

申请日：2021-07-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Chang-Yu LIN ,  Yu-Sheng HUANG

IPC: H01L33/62 ,  H01L31/0224 ,  H01L23/488 ,  H01L33/58 ,  H01L31/0232 ,  G02B6/12

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

公开(公告)号：US20220271019A1

公开(公告)日：2022-08-25

申请号：US17185499

申请日：2021-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Hsuan WU

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  G02B6/42

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

公开(公告)号：US20210126425A1

公开(公告)日：2021-04-29

申请号：US16663091

申请日：2019-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Pei-Jung YANG

IPC: H01S5/022 ,  G02B6/12 ,  H01S5/028 ,  H01S5/024

Abstract: An optoelectronic package includes a substrate having a first surface and a second surface opposite to the first surface, an optoelectronic device on the first surface of the substrate, and a first conductive through via connecting the first surface and the second surface of the substrate. The optoelectronic device is electrically connected to the first conductive through via. A method for manufacturing the optoelectronic package is also provided.

公开(公告)号：US20220084972A1

公开(公告)日：2022-03-17

申请号：US17534358

申请日：2021-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20210167856A1

公开(公告)日：2021-06-03

申请号：US17144938

申请日：2021-01-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Yuan KUNG ,  Hung-Yi LIN

IPC: H04B10/40 ,  G02B6/42

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

公开(公告)号：US20210134751A1

公开(公告)日：2021-05-06

申请号：US16673699

申请日：2019-11-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20250015069A1

公开(公告)日：2025-01-09

申请号：US18895205

申请日：2024-09-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Hsuan WU

IPC: H01L25/16 ,  G02B6/42 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

公开(公告)号：US20230403078A1

公开(公告)日：2023-12-14

申请号：US18231770

申请日：2023-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Yuan KUNG ,  Hung-Yi LIN

IPC: H04B10/40 ,  G02B6/42

CPC classification number: H04B10/40 ,  G02B6/4206 ,  G02B6/4257

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.