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    ELECTRONIC PACKAGE
    1.
    发明公开
    ELECTRONIC PACKAGE 审中-公开

    公开(公告)号：US20230400648A1

    公开(公告)日：2023-12-14

    申请号：US17838099

    申请日：2022-06-10

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Han-Chee YEN ,  Min-Yao CHENG ,  Hung-Yi LIN

    IPC: G02B6/42 ,  H01L25/16

    CPC classification number: G02B6/4246 ,  H01L25/167 ,  G02B6/428

    Abstract: The present disclosure provides an electronic package. The electronic package includes a photonic component including a first input/output (I/O) port and a second I/O port both at a side of the photonic component. The electronic package also includes a connector disposed adjacent to the side of the photonic component and configured to guide a first light carrying medium to be optically coupled with at least one of the first I/O port and second I/O port of the photonic component.

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20220181268A1

    公开(公告)日：2022-06-09

    申请号：US17111350

    申请日：2020-12-03

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu-Pin TSAI

    IPC: H01L23/552 ,  H01L21/50 ,  H01L23/31

    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

    ELECTRICAL DEVICE
    5.
    发明申请
    ELECTRICAL DEVICE 审中-公开

    公开(公告)号：US20190057809A1

    公开(公告)日：2019-02-21

    申请号：US15680059

    申请日：2017-08-17

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Teck-Chong LEE ,  Sheng-Chi HSIEH ,  Chien-Hua CHEN

    IPC: H01F27/40 ,  H01F21/12 ,  H01F27/28 ,  H01F27/29 ,  H03H7/38 ,  H01L25/16

    Abstract: An electrical device comprises a substrate, a first dielectric layer, a first die, an adjustable inductor and a second die. The substrate has a first surface. The first dielectric layer is disposed on the first surface of the substrate and has a first surface. The first die is surrounded by the first dielectric layer. The adjustable inductor is electrically connected to the first die. The adjustable inductor comprises a plurality of pillars surrounded by the first dielectric layer, a plurality of first metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars, and a plurality of second metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars. A width of at least one of the second metal strips is different than a width of at least one of the first metal strips. The second die is electrically connected to the adjustable inductor.

    ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE
    9.
    发明申请
    ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE 有权

    公开(公告)号：US20210202392A1

    公开(公告)日：2021-07-01

    申请号：US16732157

    申请日：2019-12-31

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN

    IPC: H01L23/538 ,  H01L25/18 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

    Abstract: An assembly structure includes a core-computing section and a sub-computing section. The core-computing section has a first surface and a second surface opposite to the first surface. The core-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The sub-computing section has a first surface stacked on the first surface of the core-computing section and a second surface opposite to the first surface. The sub-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The assembly structure includes a first signal transmission path and a second signal transmission path. The first signal transmission path is between the at least one conductive via of the sub-computing section and the at least one conductive via of the core-computing section. The second signal transmission path is between the second surface of the sub-computing section and the at least one conductive via of the sub-computing section.

    SYSTEM COMPRISING PACKAGED OPTICAL DEVICES
    10.
    发明申请
    SYSTEM COMPRISING PACKAGED OPTICAL DEVICES 有权

    公开(公告)号：US20210167856A1

    公开(公告)日：2021-06-03

    申请号：US17144938

    申请日：2021-01-08

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chang-Yu LIN ,  Cheng-Yuan KUNG ,  Hung-Yi LIN

    IPC: H04B10/40 ,  G02B6/42

    Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

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