公开(公告)号：US20240213205A1

公开(公告)日：2024-06-27

申请号：US18088498

申请日：2022-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chieh-Chen FU

IPC: H01L23/00 ,  G02B6/42 ,  H01L23/31

CPC classification number: H01L24/29 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4253 ,  H01L23/3157 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

公开(公告)号：US20170200682A1

公开(公告)日：2017-07-13

申请号：US14990366

申请日：2016-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia LIN ,  Chieh-Chen FU ,  Kuo Hsien LIAO ,  Cheng-Nan LIN

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/81

Abstract: A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer, where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer.

公开(公告)号：US20210167053A1

公开(公告)日：2021-06-03

申请号：US17170666

申请日：2021-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Chieh-Chen FU

IPC: H01L25/16 ,  H01L33/52 ,  H01L23/538 ,  H01L33/58

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US20180158783A1

公开(公告)日：2018-06-07

申请号：US15871805

申请日：2018-01-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia LIN ,  Chieh-Chen FU ,  Kuo Hsien LIAO ,  Cheng-Nan LIN

IPC: H01L23/552

Abstract: A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed over the top surface of the carrier and covering the electronic component; and (4) a shield layer, including a first magnetically permeable layer disposed over the package body, a first electrically conductive layer disposed over the first magnetically permeable layer, and a second magnetically permeable layer disposed over the first electrically conductive layer. The first electrically conductive layer is interposed between the first magnetically permeable layer and the second magnetically permeable layer. A permeability of the first electrically conductive layer is different from a permeability of the first magnetically permeable layer and a permeability of the second magnetically permeable layer.

公开(公告)号：US20240038712A1

公开(公告)日：2024-02-01

申请号：US17876466

申请日：2022-07-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chieh-Chen FU

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L24/16 ,  H01L24/73 ,  H01L24/48 ,  H01L25/0655 ,  H01L23/3157 ,  H01L21/565 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/48229 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/3201 ,  H01L2224/32053 ,  H01L2224/32054 ,  H01L2224/32059 ,  H01L2224/32058 ,  H01L2224/26175 ,  H01L2924/1811 ,  H01L2924/182 ,  H01L2924/183

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.

公开(公告)号：US20220214488A1

公开(公告)日：2022-07-07

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng YOU ,  Jr-Wei LIN ,  Chieh-Chen FU ,  Kao-Ming SU ,  Chen Yuan Weng

IPC: F21V8/00 ,  G02B6/36

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

公开(公告)号：US20210249369A1

公开(公告)日：2021-08-12

申请号：US16789246

申请日：2020-02-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Wei HSIEH ,  Chieh-Chen FU

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22

Abstract: A semiconductor device package includes a carrier, an emitting device, a first building-up circuit and a first package body. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The emitting element is disposed on the first surface of carrier. The first building-up circuit is disposed on the second surface of the carrier. The first package body encapsulates the lateral surface of the carrier.

公开(公告)号：US20200212023A1

公开(公告)日：2020-07-02

申请号：US16236186

申请日：2018-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Chieh-Chen FU

IPC: H01L25/16 ,  H01L33/52 ,  H01L33/58 ,  H01L23/538

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.