公开(公告)号：US20180158783A1

公开(公告)日：2018-06-07

申请号：US15871805

申请日：2018-01-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia LIN ,  Chieh-Chen FU ,  Kuo Hsien LIAO ,  Cheng-Nan LIN

IPC: H01L23/552

Abstract: A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed over the top surface of the carrier and covering the electronic component; and (4) a shield layer, including a first magnetically permeable layer disposed over the package body, a first electrically conductive layer disposed over the first magnetically permeable layer, and a second magnetically permeable layer disposed over the first electrically conductive layer. The first electrically conductive layer is interposed between the first magnetically permeable layer and the second magnetically permeable layer. A permeability of the first electrically conductive layer is different from a permeability of the first magnetically permeable layer and a permeability of the second magnetically permeable layer.