公开(公告)号：US20240329300A1

公开(公告)日：2024-10-03

申请号：US18127624

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: G02B6/12 ,  H04B10/50

CPC classification number: G02B6/12004 ,  H04B10/501

Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.

公开(公告)号：US20240130043A1

公开(公告)日：2024-04-18

申请号：US17966701

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Pao-Nan LEE ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H05K1/14

CPC classification number: H05K1/141

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.