公开(公告)号：US20230244049A1

公开(公告)日：2023-08-03

申请号：US17588105

申请日：2022-01-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Ming-Fong JHONG

IPC: G02B6/43 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/4277 ,  G02B6/4284

Abstract: The present disclosure relates to an electronic device that includes a waveguide, a plurality of transceiving portions over the waveguide, and a cavity between the waveguide and the transceiving portions and connecting the waveguide with the transceiving portions. The cavity is configured for resonating of an electromagnetic wave from the waveguide or the transceiving portions.

公开(公告)号：US20240329300A1

公开(公告)日：2024-10-03

申请号：US18127624

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: G02B6/12 ,  H04B10/50

CPC classification number: G02B6/12004 ,  H04B10/501

Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.

公开(公告)号：US20240332192A1

公开(公告)日：2024-10-03

申请号：US18128988

申请日：2023-03-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: H01L23/538 ,  G02B6/12 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC classification number: H01L23/5381 ,  G02B6/12004 ,  H01L23/36 ,  H01L24/16 ,  H01L25/167 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

公开(公告)号：US20240055365A1

公开(公告)日：2024-02-15

申请号：US17886254

申请日：2022-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Jung Jui KANG ,  Chang Chi LEE ,  Pao-Nan LEE ,  Ming-Fong JHONG

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/481 ,  H01L23/66 ,  H01L2223/6616

Abstract: An electronic device is disclosed. The electronic device includes a first interconnection structure, and a first electronic component disposed over the first interconnection structure and having an active surface and a lateral surface. The electronic device also includes a power connection disposed between the first interconnection structure and the active surface of the first electronic component, and a first non-power connection extending along the lateral surface of the first electronic component and electrically connected to the first interconnection structure. The electronic device also includes a second non-power connection disposed between the first interconnection structure and the active surface of the first electronic component. The second non-power connection is configured to block an electromagnetic interference (EMI) between the power connection and the first non-power connection.

公开(公告)号：US20210104461A1

公开(公告)日：2021-04-08

申请号：US16593884

申请日：2019-10-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chen-Chao WANG

IPC: H01L23/528

Abstract: A semiconductor device includes a dielectric layer, a first conductive layer penetrating the dielectric layer, and a grounding structure disposed within the dielectric layer and adjacent to the first conductive layer. The dielectric layer has a first surface and a second surface opposite the first surface. The first conductive layer has a first portion and a second portion connected to the first portion. The first portion has a width greater than that of the second portion.