公开(公告)号：US20230275000A1

公开(公告)日：2023-08-31

申请号：US17681694

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Chieh HUNG ,  Hung-Chun KUO

IPC: H01L23/367 ,  H01L23/50 ,  H01L23/48 ,  H01L25/18 ,  H01L23/538

CPC classification number: H01L23/3677 ,  H01L23/50 ,  H01L23/481 ,  H01L25/18 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/16

Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.

公开(公告)号：US20230215790A1

公开(公告)日：2023-07-06

申请号：US17569447

申请日：2022-01-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Hung-Chun KUO

IPC: H01L23/498 ,  H01L23/31 ,  G02B6/12

CPC classification number: H01L23/49822 ,  H01L23/3121 ,  H01L23/49811 ,  G02B6/12004

Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.

公开(公告)号：US20250096073A1

公开(公告)日：2025-03-20

申请号：US18369109

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Jung Jui KANG ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: H01L23/48 ,  H01L23/552 ,  H05K1/02

Abstract: An electronic device is disclosed. The electronic component has a front side and a backside opposite to the front side. The front side is configured to receive a first power. The backside is configured to receive a second power greater than the first power.

公开(公告)号：US20240332192A1

公开(公告)日：2024-10-03

申请号：US18128988

申请日：2023-03-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC: H01L23/538 ,  G02B6/12 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC classification number: H01L23/5381 ,  G02B6/12004 ,  H01L23/36 ,  H01L24/16 ,  H01L25/167 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

公开(公告)号：US20240282694A1

公开(公告)日：2024-08-22

申请号：US18651653

申请日：2024-04-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Hung-Chun KUO

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/50 ,  H01L23/3107 ,  H01L23/49816

Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4267 ,  G02B6/4257 ,  G02B6/43

Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US20240329344A1

公开(公告)日：2024-10-03

申请号：US18129769

申请日：2023-03-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: G02B6/43 ,  G02B6/42 ,  H01L25/16

CPC classification number: G02B6/43 ,  G02B6/4206 ,  G02B6/4239 ,  H01L25/167

Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

公开(公告)号：US20230274998A1

公开(公告)日：2023-08-31

申请号：US17681695

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Chih PAN ,  Hung-Chun KUO

IPC: H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H01L23/495

CPC classification number: H01L23/367 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/18 ,  H01L23/49575 ,  H01L23/49568

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

公开(公告)号：US20180052281A1

公开(公告)日：2018-02-22

申请号：US15238331

申请日：2016-08-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Chun KUO ,  Wei Lun WANG

IPC: G02B6/12 ,  H04B1/38 ,  G02B6/122 ,  G02B6/42

CPC classification number: G02B6/428 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/4239 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H04B1/38

Abstract: A substrate for a semiconductor device includes a polymer material filling at least one through hole extending through the substrate. and at least one optical waveguide disposed within the through hole and extending through the polymer material. A refractive index of the optical waveguide is greater than a refractive index of the polymer material.

公开(公告)号：US20250029970A1

公开(公告)日：2025-01-23

申请号：US18223526

申请日：2023-07-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui KANG ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC: H01L25/18 ,  H10B80/00

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.