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公开(公告)号：US20210375706A1
公开(公告)日：2021-12-02
申请号：US17404912
申请日：2021-08-17
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hao-Chih HSIEH , Tun-Ching PI , Sung-Hung CHIANG , Yu-Chang CHEN
IPC: H01L23/13 , H01L23/14 , H01L23/498
Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
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