Abstract:
A folding knife that uses a four bar linkage mechanism to open and close. The knife can include a means of one hand opening and closing as well as a means to become latched in, and released from, a fixed position. The four bar linkage knife includes a blade, a handle, and the motion of a four bar linkage to open and close the knife. The four bar knife provides inherent safety because the four bar linkage motion can not fold onto the users hand.
Abstract:
A folding knife that uses a four bar linkage mechanism to open and close. The knife can include a means of one hand opening and closing as well as a means to become latched in, and released from, a fixed position. The four bar linkage knife includes a blade, a handle, and the motion of a four bar linkage to open and close the knife. The four bar knife provides inherent safety because the four bar linkage motion can not fold onto the users hand.
Abstract:
Exemplary embodiments provide methods for patterning large areas, beyond those accessible with the limited single-area exposure techniques, with nanometer scale features. The methods can include forming a grating pattern to make a first interferometric exposure of a first portion of a photosensitive material disposed over a substrate by interfering two or more laser beams, wherein the two or more laser beams comprise an apodized intensity profile having a continuous intensity variation. The method can further include aligning and overlapping the grating pattern to expose a second portion of the photosensitive material such that the first portion and the second portion form a continuous grating pattern.
Abstract:
The present invention provides methods and apparatus for defining a single structure on a semiconductor wafer by spatial frequency components whereby some of the spatial frequency components are derived by optical lithography and some by interferometric lithographic techniques. Interferometric lithography images the high frequency components while optical lithography images the low frequency components. Optics collects many spatial frequencies and the interferometry shifts the spatial frequencies to high spatial frequencies. Thus, because the mask does not need to provide high spatial frequencies, the masks are configured to create only low frequency components, thereby allowing fabrication of simpler masks having larger structures. These methods and apparatus facilitate writing more complex repetitive as well as non-repetitive patterns in a single exposure with a resolution which is higher than that currently available using known optical lithography alone.
Abstract:
A displacement measuring method and device is disclosed in which speckle amplitude interferometry within a single speckle feature or a small number of features of a speckle pattern is used to achieve sub-fringe accuracy with a single detector and to measure displacement of the object under investigation with sub-wavelength accuracy at measurement speeds consistent with real-time control of manufacturing processes. The same technique applied to multiple spots on a sample with optical means for causing interference between different combinations of scattered fields, including fields from different illuminated spots, permits measurements of the total sample motion.