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公开(公告)号：US20200379519A1
公开(公告)日：2020-12-03
申请号：US16994299
申请日：2020-08-14
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20190261527A1
公开(公告)日：2019-08-22
申请号：US16405239
申请日：2019-05-07
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US10234906B2
公开(公告)日：2019-03-19
申请号：US15829372
申请日：2017-12-01
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20180164853A1
公开(公告)日：2018-06-14
申请号：US15892310
申请日：2018-02-08
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assembles can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US09898049B2
公开(公告)日：2018-02-20
申请号：US15168194
申请日：2016-05-30
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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Patent Agency Ranking
公开(公告)号：US20250103103A1
公开(公告)日：2025-03-27
申请号：US18974378
申请日：2024-12-09
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US12174673B2
公开(公告)日：2024-12-24
申请号：US17403206
申请日：2021-08-16
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20230288965A1
公开(公告)日：2023-09-14
申请号：US18199499
申请日：2023-05-19
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1698 , H04M1/0249 , H05K5/03 , H05K5/02 , H04M1/026 , H05K5/0208 , G06F1/1684 , H01Q1/2258 , H01Q1/241 , H04M1/0274 , H01Q1/42 , H05K5/0247 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20220075422A1
公开(公告)日：2022-03-10
申请号：US17525614
申请日：2021-11-12
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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20.发明授权公开(公告)号：US11194362B2
公开(公告)日：2021-12-07
申请号：US16994299
申请日：2020-08-14
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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