公开(公告)号：US20220305613A1

公开(公告)日：2022-09-29

申请号：US17673511

申请日：2022-02-16

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Bum Jick Kim ,  Jay Gurusamy

IPC: B24B37/26

Abstract: Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The upper platen may define a flexure between the first surface and the second surface within the recess. The assemblies may include a polishing pad coupled with the first surface of the upper platen. The assemblies may include a plate coupled with the upper platen along the second surface of the upper platen. The plate may define a volume within the recess of the upper platen between the second surface of the upper platen and the plate.

公开(公告)号：US09687960B2

公开(公告)日：2017-06-27

申请号：US14523482

申请日：2014-10-24

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Shou-Sung Chang ,  Bum Jick Kim

IPC: C23F1/00 ,  B24B53/017 ,  B24B53/02 ,  B24B1/00

CPC classification number: B24B53/017 ,  B24B1/00 ,  B24B53/02

Abstract: Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.