公开(公告)号：US20230185268A1

公开(公告)日：2023-06-15

申请号：US17548334

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Umesh Madhav Kelkar ,  Elizabeth Neville ,  Orlando Trejo ,  Sergey Meirovich ,  Kartik B. Shah ,  Shreyas Suresh Kher

IPC: G05B19/18 ,  G05B19/406

CPC classification number: G05B19/188 ,  G05B19/406 ,  G05B2219/32128 ,  G05B2219/45031

Abstract: Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

公开(公告)号：US20220189793A1

公开(公告)日：2022-06-16

申请号：US17120976

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Arun Chakravarthy Chakravarthy ,  Chahal Neema ,  Abhijit A. Kangude ,  Elizabeth Neville ,  Vishal S. Jamakhandi ,  Kurt R. Langeland ,  Syed A. Alam ,  Ming Xu ,  Kenneth Le

IPC: H01L21/67 ,  H01J37/32

Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may define a plurality of gas inlets and gas outlets. A number of gas outlets may be greater than a number of gas inlets. The systems may include a plurality of valve blocks that are interfaced with the gas splitter. Each valve block may define a number of gas lumens. An inlet of each of the gas lumens may be in fluid communication with one of the gas outlets. An interface between the gas splitter and each of the valve blocks may include a choke. The systems may include a plurality of output manifolds seated on the lid plate. The systems may include a plurality of output weldments that may couple an outlet of one of the gas lumens with one of the output manifolds.

公开(公告)号：US20210166921A1

公开(公告)日：2021-06-03

申请号：US16701986

申请日：2019-12-03

Applicant: Applied Materials, Inc.

Inventor： Elizabeth Neville ,  Satish Radhakrishnan ,  Kartik Shah ,  Vinay Prabhakar ,  Venkata Sharat Chandra Parimi ,  Sungwon Ha

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.