公开(公告)号：US11978646B2

公开(公告)日：2024-05-07

申请号：US15982785

申请日：2018-05-17

Applicant: Applied Materials, Inc.

Inventor： Dongming Iu ,  Kartik Shah ,  Norman L. Tam ,  Matthew Spuller ,  Jau-Jiun Chen ,  Kong Lung Samuel Chan ,  Elizabeth Neville ,  Preetham Rao ,  Abhilash J. Mayur ,  Gia Pham

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/56 ,  H01L21/687

CPC classification number: H01L21/67103 ,  C23C16/45565 ,  C23C16/4583 ,  C23C16/46 ,  C23C16/56 ,  H01L21/6719 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68792 ,  H01L21/67098

Abstract: Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.

公开(公告)号：US12228905B2

公开(公告)日：2025-02-18

申请号：US17548334

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Umesh Madhav Kelkar ,  Elizabeth Neville ,  Orlando Trejo ,  Sergey Meirovich ,  Kartik B. Shah ,  Shreyas Suresh Kher

IPC: G05B19/18 ,  G05B19/406

Abstract: Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

公开(公告)号：US12001197B2

公开(公告)日：2024-06-04

申请号：US17230897

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Elizabeth Neville ,  Umesh Madhav Kelkar ,  Mark R. Denome ,  Prashanth Kothnur ,  Karthik Ramanathan ,  Kartik Shah ,  Orlando Trejo ,  Sergey Meirovich

IPC: H01L21/67 ,  G05B13/02 ,  G05B19/418 ,  G05B19/41

CPC classification number: G05B19/41885 ,  G05B13/027 ,  G05B2219/32335 ,  G05B2219/32359 ,  G05B2219/45031 ,  H01L21/67276

Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.

公开(公告)号：US11881416B2

公开(公告)日：2024-01-23

申请号：US17120976

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Arun Chakravarthy Chakravarthy ,  Chahal Neema ,  Abhijit A. Kangude ,  Elizabeth Neville ,  Vishal S. Jamakhandi ,  Kurt R. Langeland ,  Syed A. Alam ,  Ming Xu ,  Kenneth Le

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/3244 ,  H01J37/32357 ,  H01J37/32899 ,  H01L21/67167 ,  H01J2237/006

Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may define a plurality of gas inlets and gas outlets. A number of gas outlets may be greater than a number of gas inlets. The systems may include a plurality of valve blocks that are interfaced with the gas splitter. Each valve block may define a number of gas lumens. An inlet of each of the gas lumens may be in fluid communication with one of the gas outlets. An interface between the gas splitter and each of the valve blocks may include a choke. The systems may include a plurality of output manifolds seated on the lid plate. The systems may include a plurality of output weldments that may couple an outlet of one of the gas lumens with one of the output manifolds.

公开(公告)号：US20240210916A1

公开(公告)日：2024-06-27

申请号：US18087641

申请日：2022-12-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Orlando Trejo ,  Ala Moradian ,  Elizabeth Neville ,  Umesh Madhav Kelkar ,  Satomi Murayama

IPC: G05B19/4155 ,  G06N5/022

CPC classification number: G05B19/4155 ,  G06N5/022 ,  G05B2219/45031

Abstract: In some embodiments, a method includes receiving a process recipe including process recipe setpoint data. The method further includes inputting the process recipe into one or more trained machine learning models that output predicted environmental resource usage data indicative of an environmental resource consumption associated with processing a substrate in a process chamber according to the process recipe. The method further includes outputting a recommendation associated with the process recipe based at least in part on the predicted environmental resource usage data.

公开(公告)号：US11515129B2

公开(公告)日：2022-11-29

申请号：US16701986

申请日：2019-12-03

Applicant: Applied Materials, Inc.

Inventor： Elizabeth Neville ,  Satish Radhakrishnan ,  Kartik Shah ,  Vinay Prabhakar ,  Venkata Sharat Chandra Parimi ,  Sungwon Ha

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.

公开(公告)号：US20220334569A1

公开(公告)日：2022-10-20

申请号：US17230897

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Elizabeth Neville ,  Umesh Madhav Kelkar ,  Mark R. Denome ,  Prashanth Kothnur ,  Karthik Ramanathan ,  Kartik Shah ,  Orlando Trejo ,  Sergey Meirovich

IPC: G05B19/418 ,  G05B13/02

Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.

公开(公告)号：US20240310819A1

公开(公告)日：2024-09-19

申请号：US18679298

申请日：2024-05-30

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Elizabeth Neville ,  Umesh Madhav Kelkar ,  Mark R. Denome ,  Prashanth Kothnur ,  Karthik Ramanathan ,  Kartik Shah ,  Orlando Trejo ,  Sergey Meirovich

IPC: G05B19/418 ,  G05B13/02 ,  H01L21/67

CPC classification number: G05B19/41885 ,  G05B13/027 ,  G05B2219/32335 ,  G05B2219/32359 ,  G05B2219/45031 ,  H01L21/67276

Abstract: A first selection of a first fabrication process and/or first manufacturing equipment to perform manufacturing operations of the first fabrication process is received. The first selection is input into a digital replica of the first manufacturing equipment, where the digital replica outputs physical conditions of the first fabrication process. Environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process is determined. A modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment is determined. Applying the modification to the first fabrication and/or providing the modification for display by a graphical user interface (GUI) is performed.

公开(公告)号：US20240047232A1

公开(公告)日：2024-02-08

申请号：US17880885

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Abhijit A. Kangude ,  Elizabeth Neville ,  Arun Chakravarthy Chakravarthy

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67167

Abstract: Exemplary semiconductor processing systems may include a lid plate and a gas splitter. The gas splitter may be seated on the lid plate. The gas splitter may include a top surface and a plurality of side surfaces. The gas splitter may define a gas inlet, a gas outlet, a gas lumen that extends between and fluidly couples the gas inlet with the gas outlet, and a first divert lumen that is fluidly coupled with the gas lumen and that directs gases away from a processing chamber through a divert outlet. The semiconductor processing system may include a first divert weldment. The first divert weldment may extend from and fluidly couple to the divert outlet. The first divert weldment may include a first divert weldment outlet and a second divert weldment outlet.

公开(公告)号：US20240012393A1

公开(公告)日：2024-01-11

申请号：US17981305

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Aleksey Yanovich ,  Orlando Trejo ,  Elizabeth Neville ,  Dinesh Saigal ,  Umesh Madhav Kelkar

IPC: G05B19/4065

CPC classification number: G05B19/4065 ,  G05B2219/50185

Abstract: In embodiments, a method includes receiving, by a processing device, first sensor data generated by a plurality of sensors of a process chamber of a manufacturing system during execution of a fabrication process. The method includes receiving, by the processing device, second sensor data generated by one or more external sensors that are not components of the process chamber during execution of the fabrication process. The method includes determining, by the processing device, environmental resource usage data indicative of an environmental resource consumption of the fabrication process run on the process chamber based on the first sensor data and the second sensor data. The method includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).