公开(公告)号：US11488796B2

公开(公告)日：2022-11-01

申请号：US16828602

申请日：2020-03-24

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: H01H37/76 ,  H05H1/46 ,  H05K7/20 ,  H01L35/28

Abstract: Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane.

公开(公告)号：US20210391156A1

公开(公告)日：2021-12-16

申请号：US16898244

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Kelvin Chan ,  Philip Allan Kraus ,  Thai Cheng Chua ,  Hanh Nguyen ,  Anantha Subramani

IPC: H01J37/32 ,  B08B7/00 ,  H05H1/46

Abstract: Embodiments disclosed herein include a cleaning module for the exhaust line of a chamber. In an embodiment, a mobile cleaning module comprises a chamber where the chamber comprises a first opening and a second opening. In an embodiment, the cleaning module further comprises a lid to seal the first opening. In an embodiment, the lid comprises a dielectric plate, a dielectric resonator coupled to the dielectric plate, a monopole antenna positioned in a hole into the dielectric resonator, and a conductive layer surrounding the dielectric resonator.

公开(公告)号：US11081317B2

公开(公告)日：2021-08-03

申请号：US15958470

申请日：2018-04-20

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Amormino ,  Hanh Nguyen ,  Kallol Bera ,  Philip Allan Kraus

IPC: H01J37/32 ,  H03F3/19 ,  H03F3/21

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.