公开(公告)号：US20150129165A1

公开(公告)日：2015-05-14

申请号：US14536803

申请日：2014-11-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Wendell BOYD, JR. ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/6831

Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

Abstract translation: 本文所述的实施方案提供了像素化衬底支撑组件，其能够在静电吸盘和包括衬底支撑组件的冷却基底之间的热传递的侧向和方位调谐，其进而允许在衬底支撑组件上处理的衬底的横向和方位调谐 基板支撑组件。 还提供了具有像素化基板支撑组件的处理室以及使用像素化基板支撑组件来处理基板的方法。