CONTROL SYSTEMS EMPLOYING DEFLECTION SENSORS TO CONTROL CLAMPING FORCES APPLIED BY ELECTROSTATIC CHUCKS, AND RELATED METHODS
    2.
    发明申请
    CONTROL SYSTEMS EMPLOYING DEFLECTION SENSORS TO CONTROL CLAMPING FORCES APPLIED BY ELECTROSTATIC CHUCKS, AND RELATED METHODS 有权
    使用偏转传感器控制由静电切割机应用的夹紧力的控制系统及相关方法

    公开(公告)号:US20150138687A1

    公开(公告)日:2015-05-21

    申请号:US14158112

    申请日:2014-01-17

    CPC classification number: H01L21/6833 H01L21/67288

    Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

    Abstract translation: 公开了一种包括能够控制由静电卡盘施加的夹持力的偏转传感器的控制系统及相关方法。 通过使用传感器来确定由静电卡盘支撑的工件的偏转,控制系统可以使用测量的偏转来控制由静电卡盘施加到工件的夹紧力。 控制系统对静电卡盘施加钳位电压,使得夹紧力达到并保持目标夹紧力。 以这种方式,夹紧力可以将工件固定到静电卡盘,以使得能够进行制造操作,同时防止由于不必要的较高的夹紧力而导致的工件损坏。

    PIXILATED COOLING, TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
    3.
    发明申请
    PIXILATED COOLING, TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY 审中-公开
    雾化冷却,温度控制基板支撑总成

    公开(公告)号:US20150129165A1

    公开(公告)日:2015-05-14

    申请号:US14536803

    申请日:2014-11-10

    CPC classification number: H01L21/6833 H01L21/67109 H01L21/6831

    Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

    Abstract translation: 本文所述的实施方案提供了像素化衬底支撑组件,其能够在静电吸盘和包括衬底支撑组件的冷却基底之间的热传递的侧向和方位调谐,其进而允许在衬底支撑组件上处理的衬底的横向和方位调谐 基板支撑组件。 还提供了具有像素化基板支撑组件的处理室以及使用像素化基板支撑组件来处理基板的方法。

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