公开(公告)号：US20210066038A1

公开(公告)日：2021-03-04

申请号：US17095577

申请日：2020-11-11

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Govinda RAJ ,  Matthew James BUSCHE

IPC: H01J37/32 ,  H01L21/683 ,  C23C16/458

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

公开(公告)号：US20240258075A1

公开(公告)日：2024-08-01

申请号：US18416580

申请日：2024-01-18

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Govinda RAJ ,  Matthew James BUSCHE

IPC: H01J37/32 ,  C23C16/458 ,  G01D5/26 ,  G01D11/24 ,  G01L11/02 ,  H01L21/683

CPC classification number: H01J37/3244 ,  C23C16/4586 ,  H01J37/32009 ,  H01J37/32697 ,  H01J37/32715 ,  H01J37/3299 ,  H01L21/6831 ,  H01L21/6833 ,  G01D5/26 ,  G01D5/266 ,  G01D5/268 ,  G01D11/245 ,  G01L11/025 ,  H01J2237/334

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

公开(公告)号：US20170103911A1

公开(公告)日：2017-04-13

申请号：US15385441

申请日：2016-12-20

Applicant: Applied Materials, Inc.

Inventor： Wendell BOYD, JR. ,  Vijay D. PARKHE ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

公开(公告)号：US20180330926A1

公开(公告)日：2018-11-15

申请号：US15979787

申请日：2018-05-15

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Vijay D. PARKHE ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67

Abstract: Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.

公开(公告)号：US20150129165A1

公开(公告)日：2015-05-14

申请号：US14536803

申请日：2014-11-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Wendell BOYD, JR. ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/6831

Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

Abstract translation: 本文所述的实施方案提供了像素化衬底支撑组件，其能够在静电吸盘和包括衬底支撑组件的冷却基底之间的热传递的侧向和方位调谐，其进而允许在衬底支撑组件上处理的衬底的横向和方位调谐 基板支撑组件。 还提供了具有像素化基板支撑组件的处理室以及使用像素化基板支撑组件来处理基板的方法。

公开(公告)号：US20230253188A1

公开(公告)日：2023-08-10

申请号：US18302854

申请日：2023-04-19

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, Jr. ,  Govinda RAJ ,  Matthew James BUSCHE

IPC: H01J37/32 ,  H01L21/683 ,  C23C16/458

CPC classification number: H01J37/3244 ,  H01J37/3299 ,  H01J37/32697 ,  H01L21/6833 ,  C23C16/4586 ,  H01L21/6831 ,  H01J37/32009 ,  H01J37/32715 ,  G01L11/025

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

公开(公告)号：US20180082866A1

公开(公告)日：2018-03-22

申请号：US15703666

申请日：2017-09-13

Applicant: Applied Materials, Inc.

Inventor： Kaushik ALAYAVALLI ,  Ajit BALAKRISHNA ,  Sanjeev BALUJA ,  Amit Kumar BANSAL ,  Matthew James BUSCHE ,  Juan Carlos ROCHA-ALVAREZ ,  Swaminathan T. SRINIVASAN ,  Tejas ULAVI ,  Jianhua ZHOU

IPC: H01L21/67

CPC classification number: H01L21/67103 ,  H01L21/67109 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67248 ,  H01L21/68792

Abstract: Implementations of the disclosure generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one implementation, a pedestal assembly is disclosed and includes a substrate support comprising a dielectric material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to a support member of the substrate support at a first end of the shaft, and a thermally conductive material disposed at an interface between the support member and the first end of the shaft.

公开(公告)号：US20170076915A1

公开(公告)日：2017-03-16

申请号：US14852485

申请日：2015-09-11

Applicant: Applied Materials, Inc.

Inventor： Wendell Glen BOYD, Jr. ,  Govinda RAJ ,  Matthew James BUSCHE

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32009 ,  H01J37/32697 ,  H01J37/32715 ,  H01J37/3299 ,  H01J2237/334

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

Abstract translation: 本文公开的实施例包括具有传感器组件的基板支撑件和具有该传感器组件的处理室。 在一个实施例中，衬底支架具有圆盘。 圆盘具有工件支撑表面和离开工件支撑表面的气孔。 传感器组件设置在气孔中并且被配置为检测指示设置在工件支撑表面上的工件的偏转的度量，其中传感器组件构造成允许气体在定位在气孔中时流过传感器组件 。