公开(公告)号：US20170103911A1

公开(公告)日：2017-04-13

申请号：US15385441

申请日：2016-12-20

Applicant: Applied Materials, Inc.

Inventor： Wendell BOYD, JR. ,  Vijay D. PARKHE ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

公开(公告)号：US20170167018A1

公开(公告)日：2017-06-15

申请号：US15437836

申请日：2017-02-21

Applicant: Applied Materials, Inc.

Inventor： Wendell Glen BOYD, JR. ,  Vijay D. PARKHE ,  Senh THACH

IPC: C23C16/458 ,  H01L21/687 ,  C23C14/50 ,  H01L21/683 ,  C23C16/50 ,  C23C14/04

CPC classification number: C23C16/4584 ,  C23C14/042 ,  C23C14/221 ,  C23C14/50 ,  C23C16/06 ,  C23C16/4581 ,  C23C16/463 ,  C23C16/50 ,  C23C16/507 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757

Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.

公开(公告)号：US20180330926A1

公开(公告)日：2018-11-15

申请号：US15979787

申请日：2018-05-15

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Vijay D. PARKHE ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67

Abstract: Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.

公开(公告)号：US20150129165A1

公开(公告)日：2015-05-14

申请号：US14536803

申请日：2014-11-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Wendell BOYD, JR. ,  Matthew James BUSCHE ,  Konstantin MAKHRATCHEV ,  Masanori ONO ,  Senh THACH

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/6831

Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

Abstract translation: 本文所述的实施方案提供了像素化衬底支撑组件，其能够在静电吸盘和包括衬底支撑组件的冷却基底之间的热传递的侧向和方位调谐，其进而允许在衬底支撑组件上处理的衬底的横向和方位调谐 基板支撑组件。 还提供了具有像素化基板支撑组件的处理室以及使用像素化基板支撑组件来处理基板的方法。