公开(公告)号：US20140262795A1

公开(公告)日：2014-09-18

申请号：US13829197

申请日：2013-03-14

Applicant: APPLIED MATERIALS, INC.

Inventor： Nolan L. Zimmerman ,  Randy A. Harris ,  Daniel J. Woodruff

IPC: C25D21/04

CPC classification number: C25D21/04 ,  C25D5/003 ,  C25D17/001 ,  C25D17/06

Abstract: A substrate processor uses pressurized gas to create a vortex for lifting and holding a wafer, and to create a vacuum to prevent the wafer from adhering to a contact ring seal after electroplating the wafer. A processor head has a rotor movable into and out of an electrolyte vessel. A backing plate on the rotor includes vortex outlets which create the vortex in the rotor. A vacuum channel adjacent to the perimeter of the rotor applies vacuum to the wafer edges to hold the wafer onto the backing plate. A solenoid or switch in the head has a first position to supply gas flow to the vortex outlets, and a second position to supply gas flow to an aspirator which creates the vacuum in the vacuum channel.

Abstract translation: 基板处理器使用加压气体来产生用于提升和保持晶片的涡流，并且在电镀晶片之后产生真空以防止晶片粘附到接触环密封件。 处理器头具有可移入和移出电解质容器的转子。 转子上的背板包括在转子中产生涡流的涡流出口。 邻近转子周边的真空通道对晶片边缘施加真空以将晶片保持在背板上。 头部中的螺线管或开关具有向涡流出口提供气流的第一位置，以及向吸气器供应气体的第二位置，该吸气器在真空通道中产生真空。

公开(公告)号：US20170009367A1

公开(公告)日：2017-01-12

申请号：US15198945

申请日：2016-06-30

Applicant: APPLIED Materials, Inc.

Inventor： Randy A. Harris ,  Michael Windham

IPC: C25D17/00 ,  C25D17/06 ,  H01L21/687

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06

Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.

Abstract translation: 将晶片放置在电镀系统内的卡盘组件中。 卡盘组件包括可与环接合的背板组件。 轮毂可以设置在背板组件的一侧上，用于将卡盘组件附接到用于电镀晶片的处理器的转子。 可以在背板组件的另一侧上设置晶片板。 环具有电连接到环母线的接触指状物，并且当环接合到背板组件时，环母线通过背板组件电连接到处理器中的电源。 环上的晶片密封件覆盖在接触指状物上。 可以围绕周边设置卡盘密封件。 从处理器远程执行电触点和密封件的维护。