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公开(公告)号：US20170009367A1
公开(公告)日：2017-01-12
申请号：US15198945
申请日：2016-06-30
Applicant: APPLIED Materials, Inc.
Inventor： Randy A. Harris , Michael Windham
IPC: C25D17/00 , C25D17/06 , H01L21/687
CPC classification number: C25D17/001 , C25D17/004 , C25D17/005 , C25D17/06
Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.
Abstract translation: 将晶片放置在电镀系统内的卡盘组件中。 卡盘组件包括可与环接合的背板组件。 轮毂可以设置在背板组件的一侧上，用于将卡盘组件附接到用于电镀晶片的处理器的转子。 可以在背板组件的另一侧上设置晶片板。 环具有电连接到环母线的接触指状物，并且当环接合到背板组件时，环母线通过背板组件电连接到处理器中的电源。 环上的晶片密封件覆盖在接触指状物上。 可以围绕周边设置卡盘密封件。 从处理器远程执行电触点和密封件的维护。
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公开(公告)号：US20230167573A1
公开(公告)日：2023-06-01
申请号：US18159041
申请日：2023-01-24
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , John L. Klocke , Paul Van Valkenburg , Eric J. Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R. Borjesson
CPC classification number: C25D17/12 , C25D17/001 , C25D21/12 , C25D5/08 , C25D7/123 , C25D17/007
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US11268208B2
公开(公告)日：2022-03-08
申请号：US16870290
申请日：2020-05-08
Applicant: APPLIED Materials, Inc.
Inventor： Paul R McHugh , Gregory J Wilson , Kyle M Hanson , John L Klocke , Paul Van Valkenburg , Eric J Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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Patent Agency Ranking
公开(公告)号：US11982008B2
公开(公告)日：2024-05-14
申请号：US18159041
申请日：2023-01-24
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , John L. Klocke , Paul Van Valkenburg , Eric J. Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R. Borjesson
CPC classification number: C25D17/12 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/007 , C25D21/12
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US20220145489A1
公开(公告)日：2022-05-12
申请号：US17583004
申请日：2022-01-24
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , John L. Klocke , Paul Van Valkenburg , Eric J. Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R. Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US11578422B2
公开(公告)日：2023-02-14
申请号：US17583004
申请日：2022-01-24
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , John L. Klocke , Paul Van Valkenburg , Eric J. Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R. Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US20210348296A1
公开(公告)日：2021-11-11
申请号：US16870290
申请日：2020-05-08
Applicant: APPLIED Materials, Inc.
Inventor： Paul R McHugh , Gregory J Wilson , Kyle M Hanson , John L Klocke , Paul Van Valkenburg , Eric J Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US10174437B2
公开(公告)日：2019-01-08
申请号：US15198945
申请日：2016-06-30
Applicant: APPLIED Materials, Inc.
Inventor： Randy A. Harris , Michael Windham
Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.
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