公开(公告)号：US20230206417A1

公开(公告)日：2023-06-29

申请号：US17565273

申请日：2021-12-29

Applicant: Applied Materials Israel Ltd.

Inventor： Elad COHEN ,  Victor EGOROV ,  Ilan BEN-HARUSH ,  Rafael BISTRITZER

IPC: G06T7/00 ,  G06T7/10

CPC classification number: G06T7/0004 ,  G06T7/10

Abstract: There is provided a system of examination of a semiconductor specimen, comprising a processor and memory circuitry configured to obtain, for each given candidate defect of a plurality of candidate defects in an image of the specimen, a given area of the given candidate defect in the image, obtain a reference image, perform a segmentation of at least part of the reference image, to determine, for each given candidate defect, first reference areas in the reference image matching a given reference area corresponding to the given area, select among the first reference areas, a plurality of second reference areas, obtain a plurality of corresponding second areas in the image, and use data informative of a pixel intensity of the second areas and data informative of a pixel intensity of the given area to determine whether the given candidate defect corresponds to a defect.

公开(公告)号：US20220207681A1

公开(公告)日：2022-06-30

申请号：US17135939

申请日：2020-12-28

Applicant: Applied Materials Israel Ltd.

Inventor： Roman KRIS ,  Grigory KLEBANOV ,  Einat FRISHMAN ,  Tal ORENSTEIN ,  Meir VENGROVER ,  Noa MAROM ,  Ilan BEN-HARUSH ,  Rafael BISTRITZER ,  Sharon DUVDEVANI-BAR

IPC: G06T7/00 ,  G01N21/95 ,  G03F7/20

Abstract: There is provided a system and method of generating a metrology recipe usable for examining a semiconductor specimen, comprising: obtaining a first image set comprising a plurality of first images captured by an examination tool, obtaining a second image set comprising a plurality of second images, wherein each second image is simulated based on at least one first image, wherein each second image is associated with ground truth data; performing a first test on the first image set and a second test on the second image set in accordance with a metrology recipe configured with a first parameter set, and determining, in response to a predetermined criterion not being met, to select a second parameter set, configure the metrology recipe with the second parameter set, and repeat the first test and the second test in accordance with the metrology recipe configured with the second parameter set.

公开(公告)号：US20220012861A1

公开(公告)日：2022-01-13

申请号：US16922977

申请日：2020-07-07

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda COHEN ,  Rafael BISTRITZER

IPC: G06T7/00 ,  G06K9/62

Abstract: There is provided a method and a system configured obtain an image of a semiconductor specimen including one or more arrays, each including repetitive structural elements, and one or more regions, each region at least partially surrounding a corresponding array and including features different from the repetitive structural elements, wherein the PMC is configured to, during run-time scanning of the semiconductor specimen, perform a correlation analysis between pixel intensity of the image and pixel intensity of a reference image informative of at least one of the repetitive structural elements, to obtain a correlation matrix, use the correlation matrix to distinguish between one or more first areas of the image corresponding to the one or more arrays and one or more second areas of the image corresponding the one or more regions, and output data informative of the one or more first areas of the image.