公开(公告)号：US06404067B1

公开(公告)日：2002-06-11

申请号：US09618968

申请日：2000-07-19

申请人： Kuljeet Singh ,  Joseph C. Barrett

发明人： Kuljeet Singh ,  Joseph C. Barrett

IPC分类号： H01L2348

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package including a substrate, an integrated circuit, and an encapsulant. The substrate has two opposing surfaces and an opening that extends between the two surfaces. The integrated circuit is mounted to the substrate substantially centered over the opening such that a portion of the opening is left uncovered by the integrated circuit. The encapsulant encapsulates the integrated circuit with a portion of the encapsulant extending between the two surfaces of the substrate and attached to the lower surface of the integrated circuit.

摘要翻译： 一种集成电路封装，包括衬底，集成电路和密封剂。 衬底具有两个相对的表面和在两个表面之间延伸的开口。 集成电路安装到基板上，基本上位于开口的中心，使得开口的一部分被集成电路覆盖。 密封剂封装集成电路，其中一部分密封剂在衬底的两个表面之间延伸并附接到集成电路的下表面。