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公开(公告)号:US20200067012A1
公开(公告)日:2020-02-27
申请号:US16409419
申请日:2019-05-10
Inventor: Tongshang SU , Dongfang WANG , Qinghe WANG , Ce ZHAO , Bin ZHOU , Liangchen YAN
Abstract: A display back plate, a fabricating method for the same, and a display device are provided. The display back plate includes a substrate, a transparent heat conduction layer disposed on the substrate, and an array structure layer disposed on the heat conduction layer. The array structure layer includes a light shielding layer, a first thin film transistor, and a second thin film transistor, where the light shielding layer is disposed between the transparent heat conduction layer and the first thin film transistor.
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公开(公告)号:US20250126986A1
公开(公告)日:2025-04-17
申请号:US18032281
申请日:2022-06-21
IPC: H10K59/131 , H10K59/121 , H10K59/126 , H10K59/80 , H10K102/00
Abstract: Provided is a display panel, including: a substrate; an auxiliary electrode on a side of the substrate; an insulating layer on a side, distal from the substrate, of the auxiliary electrode and a first via running through the insulating layer, the first via exposing the auxiliary electrode and being in an undercut shape; an anode layer on a side, distal from the substrate, of the insulating layer; a light emitting layer on a side, distal from the substrate, of the anode layer, the light emitting layer being broken at an opening in a side, distal from the substrate, of the first via into a first part and a second part; and a cathode layer on a side, distal from the substrate, of the light emitting layer, the cathode layer being coupled with the auxiliary electrode along a side wall of the first part of the light emitting layer.
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公开(公告)号:US20240213278A1
公开(公告)日:2024-06-27
申请号:US17913808
申请日:2021-10-26
Inventor: Haitao WANG , Ming WANG , Jun CHENG , Bin ZHOU , Jun WANG , Yongchao HUANG , Tongshang SU , Qinghe WANG
IPC: H01L27/12
CPC classification number: H01L27/1288 , H01L27/124
Abstract: The present disclosure provides a method for manufacturing a display panel, a display panel and a to-be-cut display panel, and relates to the field of display technologies. The method includes: forming a first electrostatic protective circuit and a source and drain conductive pattern on a base substrate; removing the source and drain conductive pattern within the target cutting region; forming a to-be-cut display panel by forming a superstructure on the base substrate; and cutting the to-be-cut display panel in the target cutting region. When manufacturing the internal structure of the display panel, only the source and drain conductive pattern in the target cutting region is removed, while the electrostatic protective circuit in the target cutting region is retained. In this way, the electrostatic protective circuit can always play the function of electrostatic protective during the formation of the internal structure of the display panel, such that the internal structure of the display panel is avoided from being damaged by electrostatic, the manufacturing yield of the display panel improved, the problem of low manufacturing yield of the display panel in the related technology is solved, and the effect of improving the manufacturing yield of the display panel is achieved.
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公开(公告)号:US20230380215A1
公开(公告)日:2023-11-23
申请号:US17432462
申请日:2021-02-24
Inventor: Leilei CHENG , Yongchao HUANG , Qinghe WANG , Yang ZHANG , Bin ZHOU
CPC classification number: H10K59/1201 , H10K71/20 , H10K77/10 , H10K59/82 , H10K59/87 , H10K59/32 , H10K59/1213 , G02F1/1306
Abstract: The disclosure relates to the technical field of display, in particular to a displaying substrate, a manufacturing method thereof and a display panel. The displaying substrate comprises a passivation layer (28) and a flat layer (29) covering the passivation layer (28), wherein the flat layer (29) comprises a first flat via hole and a plurality of second flat via holes, the passivation layer (28) comprises a first passivation via hole, and the first flat via hole and the first passivation via hole form a first sleeve hole (31); and the hole depth of the first flat via hole is smaller than that of each second flat via hole, and the hole depth of the first passivation via hole is greater than or equal to the difference between the maximum hole depth of all the second flat via holes and the hole depth of the first flat via hole.
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公开(公告)号:US20230363241A1
公开(公告)日:2023-11-09
申请号:US17633588
申请日:2021-04-21
Inventor: Tongshang SU , Bin ZHOU , Jun CHENG , Qinghe WANG , Ning LIU , Jun WANG , Dacheng ZHANG , Liangchen YAN
IPC: H10K59/80 , H10K59/121 , H10K59/122 , H10K59/126 , H10K59/131 , H10K59/12
CPC classification number: H10K59/80522 , H10K59/1216 , H10K59/122 , H10K59/126 , H10K59/131 , H10K59/1201
Abstract: The present disclosure provides a display substrate, a manufacturing method thereof and a display device. The present disclosure includes a driving circuit layer disposed on a substrate and a light emitting structure layer disposed at one side of the driving circuit layer away from the substrate, wherein the light emitting structure layer includes an anode, an organic light emitting layer, an organic light emitting block, a cathode and an auxiliary electrode, the organic light emitting layer is connected to the anode and the cathode respectively, the auxiliary electrode includes a bottom surface at one side close to the substrate, a top surface at a side away from the substrate and a side surface arranged between the bottom surface and the top surface.
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公开(公告)号:US20230363227A1
公开(公告)日:2023-11-09
申请号:US18354218
申请日:2023-07-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Dongfang WANG , Tongshang SU , Ming WANG , Ce ZHAO , Bin ZHOU
IPC: H10K59/35 , H10K59/126 , H10K59/121
CPC classification number: H10K59/351 , H10K59/126 , H10K59/1213 , H10K2102/103
Abstract: An OLED display substrate, a manufacturing method and a display device are provided. The OLED display substrate includes a base substrate and a plurality of pixel units arranged on the base substrate, each pixel unit includes a plurality of subpixel units, and each subpixel unit includes a switching TFT and a bottom-emission OLED, the OLED display substrate further includes a light-shielding layer arranged between the OLED and the switching TFT, and an orthogonal projection of the light-shielding layer onto the base substrate completely covers an orthogonal projection of a semiconductor region of the switching TFT onto the base substrate.
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公开(公告)号:US20230337496A1
公开(公告)日:2023-10-19
申请号:US17637504
申请日:2021-03-31
Inventor: Ning LIU , Dacheng ZHANG , Tong WU , Jun LIU , Qinghe WANG , Yang ZHANG , Bin ZHOU , Liangchen YAN , Huadong WANG , Chongchong LIU , Jie ZHANG
IPC: H10K59/131 , H10K59/12 , H10K71/20
CPC classification number: H10K59/1315 , H10K59/1201 , H10K71/231
Abstract: A display substrate, a manufacturing method thereof, and a display device are provided. The display substrate includes a base substrate, organic light-emitting elements, a data line, and an electrode line. The organic light-emitting element includes a first electrode, a light-emitting layer and a second electrode sequentially stacked; the data line is located between the base substrate and the organic light-emitting element; the electrode line is on the same layer as the data line and located in a region outside a light-emitting region of the organic light-emitting element. The display substrate further includes at least one connection portion, which is in the region outside the light-emitting region and is configured to connect the electrode line and the first electrode, the connection portion is spaced apart from the second electrode, and the light-emitting layer covers the second electrode and the at least one connection portion.
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公开(公告)号:US20220093723A1
公开(公告)日:2022-03-24
申请号:US17483504
申请日:2021-09-23
Inventor: Liangchen YAN , Jun GENG , Tongshang SU , Wei HE , Bin ZHOU
IPC: H01L27/32
Abstract: A display backplane, a manufacturing method thereof, and a display device are provided. The display backplane includes a base substrate. A thin film transistor array layer, a protective layer, a planarization layer, and a light-emitting element are arranged on the base substrate. A first through hole is formed in the protective layer, and a second through hole is formed in the planarization layer. The first through hole and the second through hole are connected. A source electrode or a drain electrode is electrically connected to an anode via the first through hole and the second through hole. Each of the first through hole and the second through hole has a sidewall inclined relative to the base substrate.
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公开(公告)号:US20210167336A1
公开(公告)日:2021-06-03
申请号:US15780359
申请日:2017-11-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Bin ZHOU , Guangcai YUAN , Dongfang WANG , Ce ZHAO , Jun CHENG , Luke DING
Abstract: The present disclosure provides a heating device for heating an OLED substrate, comprising: a heating plate, a support, and a temperature controller, the temperature controller is connected with the heating plate and the support respectively, and the temperature controller is used to synchronously heat the heating plate and the support, so that the temperature of the heating plate and the support are substantially the same; wherein the heating plate comprises an receiving portion for accommodating the support, the support is configured to be able to protrude from the heating plate and retract into the heating plate.
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公开(公告)号:US20210167098A1
公开(公告)日:2021-06-03
申请号:US17265789
申请日:2020-05-14
Inventor: Jun LIU , Liangchen YAN , Bin ZHOU , Yadong LIANG , Ning LIU , Leilei CHENG , Jingang FANG
IPC: H01L27/12
Abstract: Disclosed are a display substrate and a manufacturing method therefor, and a display device. The display substrate comprises: a substrate base, and an active layer, a gate insulating layer, a first metal film layer, an interlayer insulating layer, a second metal film layer, and a passivation layer stacked in sequence on the substrate base. The first metal film layer comprises a pattern of a gate and a gate line. The second metal film layer comprises a pattern of a source/drain and a data line. The gate line and the data line are partially arranged opposite to each other. An oxide metal layer is provided on the surface of the side of the region of the gate line opposite to the data line facing the data line.
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