公开(公告)号：US20200350374A1

公开(公告)日：2020-11-05

申请号：US16643082

申请日：2019-07-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guangcai YUAN ,  Haixu LI

IPC: H01L27/32 ,  H01L31/075 ,  H01L51/56

Abstract: A display panel and manufacturing method thereof, a display device. The display panel includes a base substrate, light-emitting element and a photoelectric conversion structure: the light-emitting element is disposed on the base substrate; the photoelectric conversion structure is disposed on the base substrate and configured to receive a part of light emitted by the light-emitting element, convert energy of light received by the photoelectric conversion structure into electric energy, and supply the electric energy to the light-emitting element.

公开(公告)号：US20190207039A1

公开(公告)日：2019-07-04

申请号：US16331092

申请日：2018-03-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qi YAO ,  Zhanfeng CAO ,  Feng ZHANG ,  Haixu LI ,  Shengguang BAN ,  Zhiyong LIU

IPC: H01L29/786 ,  H01L29/66 ,  H01L29/417 ,  H01L29/423 ,  H01L27/12

CPC classification number: H01L29/78633 ,  G09F9/00 ,  H01L27/1222 ,  H01L27/1248 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/66757

Abstract: A display panel includes a base substrate, and thin film transistors positioned on the base substrate. Each thin film transistor includes a polysilicon layer. The display panel further includes a light-shielding layer for blocking ultraviolet (UV) light that is located at a side of the polysilicon layer away from the base substrate. An orthographic projection of the polysilicon layer on the substrate is in a range of an orthographic projection of the light-shielding layer on the substrate.

公开(公告)号：US20240103315A1

公开(公告)日：2024-03-28

申请号：US18527625

申请日：2023-12-04

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guangcai YUAN ,  Haixu LI

IPC: G02F1/1335 ,  G02F1/13357

CPC classification number: G02F1/133536 ,  G02F1/133516 ,  G02F1/133531 ,  G02F1/133548 ,  G02F1/133602

Abstract: A display panel and a manufacture method thereof, and a display apparatus are provided. The display liquid crystal panel includes a first substrate and a second substrate opposite to each other; the light control panel includes a third substrate and a fourth substrate opposite to each other. The second substrate and the third substrate are between the first substrate and the fourth substrate. The light control liquid crystal layer is between the first polarizer and the second polarizer; the first polarizer is between the second polarizer and the third polarizer, and the display liquid crystal layer is between the first polarizer and the third polarizer. The first polarizer, the second polarizer, and the third polarizer are configured to allow backlight to emit out of the fourth substrate after passing through the second polarizer, the first polarizer, and the third polarizer in sequence.

公开(公告)号：US20240047250A1

公开(公告)日：2024-02-08

申请号：US17760982

申请日：2021-05-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu LI

IPC: H01L21/673 ,  H01L33/00

CPC classification number: H01L21/67336 ,  H01L33/00

Abstract: The embodiments of the present application provide a carrier plate and a transferring device. The carrier plate particularly includes a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips. The carrier plate can increase the yield and the dissociation accuracy of the light-emitting-diode chips, which can increase the yield in the process of the mass transfer and the efficiency of the mass transfer of the light-emitting-diode chips.

公开(公告)号：US20220344557A1

公开(公告)日：2022-10-27

申请号：US17417660

申请日：2020-10-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu LI ,  Guangcai YUAN ,  Zhanfeng CAO ,  Ke WANG ,  Qi QI

IPC: H01L33/62 ,  H01L33/00

Abstract: The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.

公开(公告)号：US20220246460A1

公开(公告)日：2022-08-04

申请号：US17488538

申请日：2021-09-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guangcai YUAN ,  Haixu LI ,  Xin GU ,  Jing FENG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62 ,  B65G43/10

Abstract: The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adhesive; second support structure configured to carry to-be-transferred substrate on side of the LED chips away from light-transmissive substrate; and optical control mechanism on side of light-transmissive substrate away from the LED chips and configured to control propagation direction of first light rays that irradiate onto first radiation region of the optical control mechanism to form target light rays that irradiate onto target radiation region of load substrate, so that dissociation adhesive in target radiation region is dissociated to transfer LED chips in target radiation region to to-be-transferred substrate.

公开(公告)号：US20210357050A1

公开(公告)日：2021-11-18

申请号：US16346490

申请日：2018-09-05

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu LI

IPC: G06F3/041 ,  G02F1/1333 ,  H01L27/32 ,  H01L51/56 ,  G06F3/044

Abstract: A touch display substrate, a manufacturing method, a touch display device and a driving method are provided. The touch display substrate includes: a base substrate, a first touch-control electrode, a second touch-control electrode and a separation pattern. The base substrate includes multiple pixel units, each pixel unit is provided with a first electrode and a second electrode insulated from each other. The separation pattern is arranged between two adjacent pixel units and is made of an insulating material. The first touch-control electrode is located at a side of the separation pattern close to the base substrate. The second touch-control electrode is located at a side of the separation pattern away from the base substrate. The first touch-control electrode is arranged in an identical layer to the first electrode, and the second touch-control electrode is arranged in an identical layer to the second electrode.

公开(公告)号：US20210233940A1

公开(公告)日：2021-07-29

申请号：US16966146

申请日：2019-12-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu LI ,  Zhanfeng CAO ,  Ke WANG

IPC: H01L27/12 ,  H01L25/16 ,  H01L23/00

Abstract: A circuit backplane of a display panel, a method for manufacturing the same, and a display panel are provided. The circuit backplane includes a substrate and a plurality of circuit regions on the substrate. Each of the plurality of circuit regions includes a cathode soldered electrode, an anode soldered electrode, and a flow blocking island that are on the substrate. The flow blocking island is between the cathode soldered electrode and the anode soldered electrode, and in a thickness direction of the circuit backplane, a height of the flow blocking island is greater than each of a height of the cathode soldered electrode and a height of the anode soldered electrode.

公开(公告)号：US20210072591A1

公开(公告)日：2021-03-11

申请号：US16825781

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guangcai YUAN ,  Haixu LI

IPC: G02F1/1335

Abstract: The present disclosure provides a stacked display panel, a manufacturing method, and a display device. The stacked display panel includes a first display substrate, a second display substrate, and a third display substrate arranged in sequence. A color filter layer is on a side of the second display substrate facing the first display substrate, and a polarizing layer is on a side of the second display substrate facing the third display substrate. A first polarizer is on a side of the first display substrate facing away from the second display substrate, and a transmission axis direction of the first polarizer and a transmission axis direction of the polarizing layer are perpendicular to each other. A second polarizer is on a side of the third display substrate facing away from the second display substrate, and transmission axis directions of the second polarizer and the polarizing layer are perpendicular to each other.

公开(公告)号：US20190081179A1

公开(公告)日：2019-03-14

申请号：US16123299

申请日：2018-09-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jianguo WANG ,  Haixu LI

IPC: H01L29/786 ,  H01L21/02 ,  H01L29/66

Abstract: The disclosure relates to the field of display technologies, and discloses a thin film transistor, a method for fabricating the same, an array substrate, and a display device, and the method for fabricating a thin film transistor includes: forming a light-shielding layer pattern and an active layer pattern on an underlying substrate in a patterning process, wherein the active layer pattern is located on the side of the light-shielding layer pattern away from the underlying substrate, and the material of the light-shielding layer pattern is resin; and forming a gate insulation layer, a gate pattern, an interlayer insulation layer, and source and drain electrodes on the active layer pattern.