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公开(公告)号：US20220123024A1
公开(公告)日：2022-04-21
申请号：US17281015
申请日：2020-01-03
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhanfeng CAO , Yingwei LIU , Ke WANG , Guocai ZHANG , Jianguo WANG , Zhiwei LIANG , Haixu LI , Muxin DI
Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.
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公开(公告)号：US20210408330A1
公开(公告)日：2021-12-30
申请号：US16766735
申请日：2019-07-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Guangcai YUAN , Zhijun LV , Haixu LI , Xiaoxin SONG , Feng ZHANG , Wenqu LIU , Liwen DONG , Zhao CUI , Libo WANG , Detian MENG
Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.
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公开(公告)号：US20210066425A1
公开(公告)日：2021-03-04
申请号：US16641560
申请日：2019-08-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Muxin DI , Yingwei LIU , Zhiwei LIANG , Haixu LI , Zhanfeng CAO
IPC: H01L27/32 , H01L51/56 , G09G3/3225
Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.
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公开(公告)号：US20210027698A1
公开(公告)日：2021-01-28
申请号：US16899620
申请日：2020-06-12
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haixu LI
Abstract: The present disclosure provides a driving backplane, including: a base substrate, a driving circuit arranged on the base substrate, an insulation layer on a side of the driving circuit facing away from the base substrate, a plurality of first tip structures arranged on a side of the insulation layer facing away from the base substrate, and a plurality of contact electrodes arranged on the side of the insulation layer facing away from the base substrate. The driving circuit includes a plurality of output terminals, the insulation layer includes a plurality of openings and the output terminals and the openings are in a one-to-one correspondence. The contact electrodes are electrically connected with the output terminals through the openings. Each of the contact electrodes covers the plurality of first tip structures to constitute a plurality of second tip structures having the same appearance as the first tip structures.
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公开(公告)号：US20200235127A1
公开(公告)日：2020-07-23
申请号：US16682395
申请日：2019-11-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu LI , Zhanfeng CAO , Ke WANG
IPC: H01L27/12 , H01L25/075
Abstract: A micro LED display panel and a method for fabricating the same are disclosed, and the micro LED display panel includes a TFT back panel, and a micro LED fixed on the TFT back panel, wherein the TFT back panel includes a substrate, and a first insulation layer and a second insulation layer stacked over the substrate in that order, wherein the first insulation layer includes a groove filled with the second insulation layer, and a normal projection of the groove onto the substrate does not overlap with a normal projection of a TFT area in the TFT back panel onto the substrate, wherein the rigidity of the second insulation layer is lower than the rigidity of the first insulation layer.
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Patent Agency Ranking
公开(公告)号：US20190237488A1
公开(公告)日：2019-08-01
申请号：US16330922
申请日：2018-05-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haixu LI , Zhanfeng CAO , Qi YAO , Dapeng XUE , Da LU
IPC: H01L27/12 , H01L29/66 , H01L29/786
CPC classification number: H01L27/1218 , H01L29/6675 , H01L29/78633 , H01L29/78672
Abstract: The present disclosure provides a field of display technologies, and in particular, to a LTPS substrate and a fabricating method thereof, a thin film transistor thereof, an array substrate thereof, and a display device thereof. The LTPS substrate, able to be used for the fabrication of a thin film transistor, includes a light shielding layer, the light shielding layer mainly composed of amorphous silicon doped with a lanthanide element. The present disclosure mainly employs an amorphous silicon film layer doped with the lanthanide element as the light shielding layer of the LTPS substrate, which not only ensures the light shielding efficiency but also reduces the production process, and further prevents the occurrence of the H explosion problem due to H exuding during the ELA process.
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公开(公告)号：US20250113693A1
公开(公告)日：2025-04-03
申请号：US18294552
申请日：2022-08-31
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu LI , Zhanfeng CAO , Xinxin ZHAO
IPC: H10H29/855 , H10H29/01 , H10H29/851 , H10H29/854
Abstract: A display panel, a manufacturing method therefor and a display device are provided. The display panel includes a drive backplate; at least one light emitting unit disposed on the drive backplate; a support structure disposed on the drive backplate, wherein an orthographic projection of the support structure on the drive backplate is not overlapped with an orthographic projection of the at least one light emitting unit on the drive backplate; a light shielding layer disposed on the drive backplate, wherein the light shielding layer covers at least part of the support structure and an orthographic projection of the light shielding layer on the drive backplate is not overlapped with the orthographic projection of the at least one light emitting unit on the drive backplate.
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公开(公告)号：US20240371848A1
公开(公告)日：2024-11-07
申请号：US18776342
申请日：2024-07-18
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guangcai YUAN , Haixu LI
Abstract: Provided is a display substrate. The display substrate includes: an adhesive layer disposed on a side of the substrate, wherein the adhesive layer includes a plurality of adhesive blocks arranged in an array; and a plurality of light-emitting diode groups disposed on a side, away from the substrate, of the adhesive layer, wherein each of the plurality of light-emitting diode groups includes at least one light-emitting diode, and the plurality of light-emitting diode groups are in one-to-one correspondence with the plurality of adhesive blocks; wherein the adhesive layer is an adhesive layer whose adhesion decreases under irradiation by a laser.
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公开(公告)号：US20240019726A1
公开(公告)日：2024-01-18
申请号：US18032789
申请日：2020-10-30
Applicant: BOE Technology Group Co., Ltd.
IPC: G02F1/1333
CPC classification number: G02F1/133354 , G02F1/133377
Abstract: A mass transfer method for micro light-emitting diodes (W) includes: picking up micro light-emitting diodes (W) on an element substrate (200) by using a transfer substrate (300), and transferring the micro light-emitting diodes (W) after pickup to an intermediate carrying substrate (400); and transferring micro light-emitting diodes (W), which are on the intermediate carrying substrate (400) and correspond to all sub-pixels (SPX) on a target substrate (100), into the sub-pixels (SPX) of the target substrate (100) at one time, such that all the sub-pixels (SPX) on the target substrate (100) receives the micro light-emitting diodes (W) at one time.
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公开(公告)号：US20210407841A1
公开(公告)日：2021-12-30
申请号：US16770655
申请日：2019-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue DONG , Guangcai YUAN , Zhijun LV , Haixu LI , Zhiwei LIANG , Huijuan WANG , Ke WANG , Zhanfeng CAO , Hsuanwei MAI
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.
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