公开(公告)号：US20150280167A1

公开(公告)日：2015-10-01

申请号：US14236303

申请日：2013-08-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jiahao Zhang

IPC: H01L51/52

CPC classification number: H01L51/524 ,  H01L51/5246 ,  Y10T428/24488

Abstract: Disclosed are a packaging cover plate for an organic light-emitting device (OLED), an OLED, and a display device. The packaging cover plate may comprise a packaging surface bonded with a substrate using a packaging adhesive, wherein a groove structure for accommodating the packaging adhesive is formed on a periphery of the package surface of the packaging cover plate.

Abstract translation: 公开了一种用于有机发光器件（OLED），OLED和显示器件的封装盖板。 包装盖板可以包括使用包装粘合剂与基材结合的包装表面，其中在包装盖板的包装表面的周围形成有用于容纳包装粘合剂的槽结构。

公开(公告)号：US11974491B2

公开(公告)日：2024-04-30

申请号：US16964875

申请日：2020-02-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Penghao Gu ,  Paoming Tsai ,  Song Zhang ,  Chunyan Xie ,  Jiahao Zhang

IPC: H01F7/06 ,  H10K71/00 ,  H10K77/10

CPC classification number: H10K77/111 ,  H10K71/00

Abstract: A support structure, a manufacturing method thereof and a display device are provided. The support structure includes a metal substrate, and a buffer layer provided on the metal substrate; the support structure includes a bending region and a non-bending region; a portion of the metal substrate located in the bending region has a recess so that a thickness of the portion of the metal substrate located in the bending region is smaller than a thickness of a portion of the metal substrate located in the non-bending region; and the buffer layer is provided on a side of the metal substrate having the recess, and is at least located in the recess.

公开(公告)号：US20210217975A1

公开(公告)日：2021-07-15

申请号：US16964875

申请日：2020-02-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Penghao Gu ,  Paoming Tsai ,  Song Zhang ,  Chunyan Xie ,  Jiahao Zhang

IPC: H01L51/00 ,  H01L51/56

Abstract: A support structure, a manufacturing method thereof and a display device are provided. The support structure includes a metal substrate, and a buffer layer provided on the metal substrate; the support structure includes a bending region and a non-bending region; a portion of the metal substrate located in the bending region has a recess so that a thickness of the portion of the metal substrate located in the bending region is smaller than a thickness of a portion of the metal substrate located in the non-bending region; and the buffer layer is provided on a side of the metal substrate having the recess, and is at least located in the recess.

公开(公告)号：US11008484B1

公开(公告)日：2021-05-18

申请号：US16640113

申请日：2019-08-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shuang Du ,  Pao Ming Tsai ,  Jiahao Zhang ,  Yunjin Liu

IPC: C09J7/38 ,  C09J11/08 ,  C09J7/10 ,  G06F3/041 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L51/00

Abstract: An optical adhesive, a method for manufacturing an optical adhesive, and a display device are provided. The optical adhesive includes a first, adhesive Layer, a second adhesive layer, and a third adhesive layer that are sequentially stacked, a storage modulus of the first adhesive layer is greater than a storage modulus of the third adhesive laver; and the storage modulus of the first adhesive layer and the storage modulus pf the third adhesive layer are both greater than a storage modulus of the second adhesive layer.

公开(公告)号：US20200083468A1

公开(公告)日：2020-03-12

申请号：US16410471

申请日：2019-05-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jiahao Zhang ,  Penghao Gu ,  Paoming Tsai

IPC: H01L51/00 ,  H01L51/56

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.