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公开(公告)号:US20220352434A1
公开(公告)日:2022-11-03
申请号:US17610400
申请日:2020-11-19
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Tianhao LU , Wei HUANG , Dejiang ZHAO , Yu TIAN , Xiaoyun LIU , Qian SUN , Qian JIN , Yang LI
Abstract: A light-emitting device includes: a light-emitting element; a light conversion layer disposed on a light exit side of the light-emitting element and including a first portion and a second portion located on a side of the first portion in a first direction; a first material layer disposed between the light-emitting element and the light conversion layer and configured such that light emitted by the light-emitting element is incident into the light conversion layer; and a second material layer on a side of the first material layer in the first direction, a third material layer on a side face of the light conversion layer, and a fourth material layer on a side of the light conversion layer away from the light-emitting element, which are configured such that light unconverted by the light conversion layer is reflected on surfaces of a structure formed by the second, third and fourth material layers.
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公开(公告)号:US20210407977A1
公开(公告)日:2021-12-30
申请号:US17358235
申请日:2021-06-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Abstract: The present disclosure provides a display panel, a method for manufacturing a display panel and a display device. The display panel includes a substrate, and a light emitting element array and a quantum dot color filter array arranged on the substrate, the quantum dot color filter array is arranged on a light exiting side of the light emitting element array, and quantum dot color filters in the quantum dot color filter array correspond to light emitting elements in the light emitting element array one to one, and the display panel further includes a blocking structure arranged between the light emitting element array and the quantum dot color filter array so as to block heat dissipated by the light emitting elements from being conducted to the quantum dot color filters.
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13.
公开(公告)号:US20250120240A1
公开(公告)日:2025-04-10
申请号:US18729170
申请日:2023-01-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Wei LI , Mingxing WANG , Zhiqiang JIAO , Qian SUN , Huajie YAN , Yichi ZHANG
IPC: H10H29/85 , H10H20/01 , H10H20/812 , H10H20/825 , H10H29/01 , H10H29/852 , H10H29/855
Abstract: A chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. The chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. The light-emitting layer includes light-emitting portions. Each light-emitting portion includes at least two light-emitting sub-portions. The electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. The at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. Among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion. The first selected light-emitting sub-portion is connected to the cathode, and the second selected light-emitting sub-portion is connected to an anode.
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14.
公开(公告)号:US20240313036A1
公开(公告)日:2024-09-19
申请号:US18028452
申请日:2022-05-18
Applicant: BOE Technology Group Co., Ltd.
Inventor: Mingxing WANG , Wei LI , Huajie YAN , Qian SUN , Xue DONG , Guangcai YUAN , Qi QI , Xuan LIANG , Fei WANG
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: Provided in the disclosure are a light-emitting chip and a preparation method thereof, a light-emitting substrate, and a display device. The light-emitting chip includes: a silicon-based substrate including a plurality of sub-pixel openings; a plurality of light-emitting devices formed on one side of the silicon-based substrate; wherein the light-emitting devices are in one-to-one correspondence to the sub-pixel openings, and orthographic projections of the light-emitting devices on the silicon-based substrate overlap with the sub-pixel openings; and a plurality of photoluminescent color films located in at least part of the sub-pixel openings.
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公开(公告)号:US20240306465A1
公开(公告)日:2024-09-12
申请号:US18020629
申请日:2022-03-09
Applicant: BOE Technology Group Co., Ltd.
Inventor: Yu TIAN , Tianhao LU , Yang LI , Qian JIN , Qian SUN , Dejiang ZHAO , Wei HUANG
IPC: H10K59/38 , H10K59/122 , H10K59/35 , H10K59/80
CPC classification number: H10K59/38 , H10K59/122 , H10K59/35 , H10K59/8731 , H10K59/8792
Abstract: A display panel includes: a first base substrate; a light emitting device layer located at a side of the first base substrate, including three light emitting devices respectively located in three sub-pixels; a thin film encapsulation layer located at a side of the light emitting device layer away from the first base substrate; a color filter layer located at a side of the color conversion layer away from the first base substrate, and at least including a first light shielding pattern, a first color filter pattern and a second color filter pattern, wherein the first light shielding pattern defines a plurality of light transmitting areas; a color conversion layer located between the light emitting device layer and the color filter layer, and including a first color conversion pattern, a second color conversion pattern and a transmission pattern respectively located within three sub-pixels.
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