公开(公告)号：US20220384540A1

公开(公告)日：2022-12-01

申请号：US16980836

申请日：2020-04-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengjie QIN ,  Rui HONG ,  Chunyan XIE ,  Tao WANG ,  Song ZHANG

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display area, a mounting hole located in the display area, and an encapsulation region located between the display area and the mounting hole. The encapsulation region includes an insulating layer, an encapsulation pixel definition layer arranged on the insulating layer, and a partition structure layer arranged on the encapsulation pixel definition layer. The encapsulation pixel definition layer includes multiple spaced protrusions, the partition structure layer includes multiple spaced columns, the columns are arranged on the protrusions, a functional layer is arranged on the multiple spaced columns, and the functional layer is broken by the columns.

公开(公告)号：US20210226162A1

公开(公告)日：2021-07-22

申请号：US16652712

申请日：2019-09-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lingzhi QIAN ,  Rui HONG ,  Song ZHANG ,  Penghao GU

IPC: H01L51/52 ,  H01L51/56 ,  H01L33/56

Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

公开(公告)号：US20160296907A1

公开(公告)日：2016-10-13

申请号：US14762050

申请日：2014-10-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Rui HONG ,  Dan WANG ,  Seiji FUJINO

IPC: B01J20/16 ,  C03C8/24 ,  C03C3/21 ,  C03C8/08 ,  B01J20/10 ,  B01J20/06

CPC classification number: B01J20/165 ,  B01J20/06 ,  B01J20/10 ,  C03C3/21 ,  C03C8/08 ,  C03C8/24 ,  C03C2205/00 ,  H01L51/5246 ,  H01L51/5259 ,  H01L51/56

Abstract: A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Abstract translation: 用于包装电子器件的组合物包括基质和具有水蒸汽吸附能力的吸附材料，并且吸附材料包括绿坡缕石和/或沸石。 通过添加具有吸附效果的凹凸棒石和/或沸石来改变玻璃料的配方，用于包装电子器件的组合物可以有效地减少水蒸气对电子器件的影响，从而有效地延长封装电子器件的使用寿命 。