Abstract:
The present disclosure provides a packaging structure of the OLED device and an OLED device. The packaging structure of the OLED device encapsulates an OLED light-emitting structure of the OLED. The packaging structure includes an inorganic barrier layer, an organic sealing layer and a sacrificial protective layer. The organic sealing layer is laminated with the inorganic barrier layer. The sacrificial protective layer is disposed on one side of the organic sealing layer far away from the OLED light-emitting structure, and the sacrificial protective layer is in close contact with the side of the organic sealing layer.
Abstract:
A display substrate, a preparation method therefor, and a display apparatus. The display substrate comprises: a plurality of pixel island areas that are separated from one another, a plurality of hole areas, and a connection bridge area that connects the plurality of pixel island areas. The hole areas each comprise a base substrate and an encapsulation layer, the base substrate is provided with an aperture, a barrier structure is provided on the side of the base substrate close to the aperture, and the encapsulation layer covers the side of the base substrate close to the aperture.
Abstract:
Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.
Abstract:
The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.
Abstract:
Provided in the present disclosure are a display substrate, a preparation method therefor, and a display apparatus. The display substrate includes a substrate, a light-emitting structure layer disposed on the substrate, and a encapsulation structure layer disposed on the light-emitting structure layer; the encapsulation structure layer includes a encapsulation layer and at least one transition layer; a side of a transition layer adjacent to the substrate makes contact with a first side film layer, and a side of a transition layer away from the substrate makes contact with a second side film layer; the adhesion of the at least one transition layers is greater than that of one film layer among the first side film layer and the second side film layer, and less than that of the other film layer among the first side film layer and the second side film layer.
Abstract:
Embodiments of the present disclosure provide a thin film encapsulation structure and a method for manufacturing the same. The thin film encapsulation structure includes a laminated layer for encapsulating a member to be encapsulated located on a substrate, the laminated layer including an organic layer and an inorganic layer alternately stacked, wherein an outermost layer of the laminated layer is the inorganic layer, the organic layer having an inner surface facing the member, an outer surface opposite to the inner surface, and an end surface located between the inner and outer surface and extending over a region, at a periphery of the member, of the substrate, a restriction layer, for positioning the organic layer, located between the end surface of the organic layer and a surface of the substrate, wherein the organic layer has one of hydrophilicity and hydrophobicity and the restriction layer has the other of hydrophilicity and hydrophobicity.
Abstract:
Embodiments of the present invention disclose a display panel and an encapsulation method thereof, and relate to the field of display technology. The display panel comprises a first substrate and a second substrate which are disposed in opposition to each other. The first substrate and the second substrate are encapsulated by a sealant. In a non-display area of the display panel, a first adsorption layer is disposed on one of the first substrate and the second substrate, and a second adsorption layer is disposed on the other of the first substrate and the second substrate. The first adsorption layer and the second adsorption layer may be attracted to each other by magnetic force. Embodiments of the present invention can effectively avoid the separation of the first substrate and the second substrate due to the stress released during the process of melting the sealant, thereby improving the problem of poor encapsulation caused thereby.
Abstract:
The present disclosure provides a display substrate and preparation method thereof, and a display apparatus. The display substrate includes a display region, and the display region includes at least one pin area, in a plane perpendicular to the display substrate, the pin area includes a planarization layer disposed on a base substrate, a partition layer disposed on a side of the planarization layer away from the base substrate, and an encapsulation structure layer disposed on a side of the partition layer away from the base substrate; a pin structure is provided on the planarization layer and the partition layer, and the encapsulation structure layer covers the pin structure.
Abstract:
The present invention discloses a packaging device and a packaging method and relates to a field of manufacturing technique of a display panel. The packaging device is used to package a display panel, the display panel comprising a first substrate and a second substrate that are arranged opposed to each other and are able to be packaged by a sealing material, the packaging device comprising a first adsorption part and a second adsorption part that are able to attract each other through a magnetic force, one of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the first substrate, and the other of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the second substrate.
Abstract:
A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate (2) on a platform (1), and arranging a glass frit in a packaging region of the first substrate (2); cell-assembling a second substrate (3) and the first substrate (2); and pre-heating the first substrate (2) and the second substrate (3) which are cell-assembled.