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公开(公告)号：US20190058162A1
公开(公告)日：2019-02-21
申请号：US15992880
申请日：2018-05-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Rui HONG
Abstract: The present disclosure provides a packaging structure of the OLED device and an OLED device. The packaging structure of the OLED device encapsulates an OLED light-emitting structure of the OLED. The packaging structure includes an inorganic barrier layer, an organic sealing layer and a sacrificial protective layer. The organic sealing layer is laminated with the inorganic barrier layer. The sacrificial protective layer is disposed on one side of the organic sealing layer far away from the OLED light-emitting structure, and the sacrificial protective layer is in close contact with the side of the organic sealing layer.
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公开(公告)号：US20230040100A1
公开(公告)日：2023-02-09
申请号：US17787953
申请日：2021-08-09
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengjie QIN , Shantao CHEN , Fangxu CAO , Tao SUN , Song ZHANG , Rui HONG , Ziyu ZHANG
Abstract: A display substrate, a preparation method therefor, and a display apparatus. The display substrate comprises: a plurality of pixel island areas that are separated from one another, a plurality of hole areas, and a connection bridge area that connects the plurality of pixel island areas. The hole areas each comprise a base substrate and an encapsulation layer, the base substrate is provided with an aperture, a barrier structure is provided on the side of the base substrate close to the aperture, and the encapsulation layer covers the side of the base substrate close to the aperture.
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公开(公告)号：US20170133624A1
公开(公告)日：2017-05-11
申请号：US15104415
申请日：2016-02-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Rui HONG
CPC classification number: H01L51/5243 , H01J2217/49264 , H01L27/32 , H01L27/322 , H01L27/3246 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L51/529 , H01L51/56 , H05B33/04
Abstract: Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.
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公开(公告)号：US20160285037A1
公开(公告)日：2016-09-29
申请号：US14761866
申请日：2014-10-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Rui HONG , Dan WANG , Seiji FUJINO
CPC classification number: H01L51/5237 , C03C3/142 , C03C3/21 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/18 , C03C12/00 , C08K3/40 , C08K2003/085 , C09D1/00 , C09D5/34 , C09D7/61 , C09D17/002 , C09D17/006 , H01L51/5246
Abstract: The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.
Abstract translation: 本发明提供一种包含玻璃粉末和添加剂的玻璃粉末混合物，其中添加剂包括铜粉末，并且基于100质量％的玻璃粉末共混物的总量，铜粉占2-3质量％。 本发明还提供一种玻璃粉末糊剂和光电封装体。 由于向玻璃粉末中添加铜粉末，可以降低玻璃粉末共混物的熔点，从而通过使用激光降低熔融玻璃粉末混合物的温度，并降低在封装期间产生的热应力。
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公开(公告)号：US20220416202A1
公开(公告)日：2022-12-29
申请号：US17787604
申请日：2021-09-02
Applicant: BOE Technology Group Co., Ltd.
Inventor： Tao WANG , Tao SUN , Chengjie QIN , Ziyu ZHANG , Song ZHANG , Youwei WANG , Rui HONG
Abstract: Provided in the present disclosure are a display substrate, a preparation method therefor, and a display apparatus. The display substrate includes a substrate, a light-emitting structure layer disposed on the substrate, and a encapsulation structure layer disposed on the light-emitting structure layer; the encapsulation structure layer includes a encapsulation layer and at least one transition layer; a side of a transition layer adjacent to the substrate makes contact with a first side film layer, and a side of a transition layer away from the substrate makes contact with a second side film layer; the adhesion of the at least one transition layers is greater than that of one film layer among the first side film layer and the second side film layer, and less than that of the other film layer among the first side film layer and the second side film layer.
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Patent Agency Ranking
公开(公告)号：US20210336200A1
公开(公告)日：2021-10-28
申请号：US16331294
申请日：2018-09-12
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Abstract: Embodiments of the present disclosure provide a thin film encapsulation structure and a method for manufacturing the same. The thin film encapsulation structure includes a laminated layer for encapsulating a member to be encapsulated located on a substrate, the laminated layer including an organic layer and an inorganic layer alternately stacked, wherein an outermost layer of the laminated layer is the inorganic layer, the organic layer having an inner surface facing the member, an outer surface opposite to the inner surface, and an end surface located between the inner and outer surface and extending over a region, at a periphery of the member, of the substrate, a restriction layer, for positioning the organic layer, located between the end surface of the organic layer and a surface of the substrate, wherein the organic layer has one of hydrophilicity and hydrophobicity and the restriction layer has the other of hydrophilicity and hydrophobicity.
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公开(公告)号：US20160359131A1
公开(公告)日：2016-12-08
申请号：US14891915
申请日：2015-04-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD
Inventor： Xinwei GAO , Dan WANG , Rui HONG , Chao KONG
CPC classification number: H01L51/524 , H01L51/52 , H01L51/5237 , H01L51/5246 , H01L51/56
Abstract: Embodiments of the present invention disclose a display panel and an encapsulation method thereof, and relate to the field of display technology. The display panel comprises a first substrate and a second substrate which are disposed in opposition to each other. The first substrate and the second substrate are encapsulated by a sealant. In a non-display area of the display panel, a first adsorption layer is disposed on one of the first substrate and the second substrate, and a second adsorption layer is disposed on the other of the first substrate and the second substrate. The first adsorption layer and the second adsorption layer may be attracted to each other by magnetic force. Embodiments of the present invention can effectively avoid the separation of the first substrate and the second substrate due to the stress released during the process of melting the sealant, thereby improving the problem of poor encapsulation caused thereby.
Abstract translation: 本发明的实施例公开了显示面板及其封装方法，涉及显示技术领域。 显示面板包括彼此相对设置的第一基板和第二基板。 第一衬底和第二衬底被密封剂包封。 在显示面板的非显示区域中，第一吸附层设置在第一基板和第二基板之一上，第二吸附层设置在第一基板和第二基板的另一个上。 第一吸附层和第二吸附层可以通过磁力彼此吸引。 本发明的实施例可以有效地避免由于在密封剂熔化过程中释放的应力而使第一基板和第二基板分离，由此改善了由此引起的不良封装的问题。
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公开(公告)号：US20240188391A1
公开(公告)日：2024-06-06
申请号：US17787601
申请日：2021-08-23
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ziyu ZHANG , Tao WANG , Tao SUN , Youwei WANG , Rui HONG
IPC: H10K59/80 , H10K59/122
CPC classification number: H10K59/8731 , H10K59/122
Abstract: The present disclosure provides a display substrate and preparation method thereof, and a display apparatus. The display substrate includes a display region, and the display region includes at least one pin area, in a plane perpendicular to the display substrate, the pin area includes a planarization layer disposed on a base substrate, a partition layer disposed on a side of the planarization layer away from the base substrate, and an encapsulation structure layer disposed on a side of the partition layer away from the base substrate; a pin structure is provided on the planarization layer and the partition layer, and the encapsulation structure layer covers the pin structure.
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公开(公告)号：US20160284942A1
公开(公告)日：2016-09-29
申请号：US14892414
申请日：2015-04-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinwei GAO , Dan WANG , Rui HONG , Chao KONG
CPC classification number: H01L33/483 , H01L21/67126 , H01L51/5246 , H01L51/56 , H01L2933/0033
Abstract: The present invention discloses a packaging device and a packaging method and relates to a field of manufacturing technique of a display panel. The packaging device is used to package a display panel, the display panel comprising a first substrate and a second substrate that are arranged opposed to each other and are able to be packaged by a sealing material, the packaging device comprising a first adsorption part and a second adsorption part that are able to attract each other through a magnetic force, one of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the first substrate, and the other of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the second substrate.
Abstract translation: 本发明公开了一种包装装置和包装方法，涉及显示面板的制造技术领域。 所述包装装置用于封装显示面板，所述显示面板包括彼此相对布置并且能够由密封材料包装的第一基板和第二基板，所述包装装置包括第一吸附部分和 能够通过磁力彼此吸引的第二吸附部，第一吸附部和第二吸附部中的一个被配置为可拆卸地布置在第一基板的外侧，另一个是第一吸附部和第二吸收部 吸附部构造成可拆卸地配置在第二基板的外侧。
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公开(公告)号：US20160276622A1
公开(公告)日：2016-09-22
申请号：US14768944
申请日：2014-11-12
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Seiji FUJINO , Wei CUI , Xiaohu WANG , Rui HONG
CPC classification number: H01L51/5246 , C03C8/24 , H01L51/0024 , H01L51/56 , H01L2251/566
Abstract: A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate (2) on a platform (1), and arranging a glass frit in a packaging region of the first substrate (2); cell-assembling a second substrate (3) and the first substrate (2); and pre-heating the first substrate (2) and the second substrate (3) which are cell-assembled.
Abstract translation: 提供了一种激光封装方法和显示面板的制造方法。 激光打包方法包括将第一基板（2）放置在平台（1）上，并且在第一基板（2）的包装区域中布置玻璃料; 电池组装第二基板（3）和第一基板（2）; 并预热第一基板（2）和第二基板（3），这些基板（2）和第二基板（3）被单元组装。
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