公开(公告)号：US11805670B2

公开(公告)日：2023-10-31

申请号：US17286263

申请日：2020-09-21

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhen Li ,  Shasha Zhu ,  Yulin Wang ,  Rui Hou ,  Yide Du

IPC: H10K50/844 ,  H10K71/00 ,  H10K59/12

CPC classification number: H10K50/844 ,  H10K71/00 ,  H10K59/12

Abstract: This disclosure provides a packaging structure for a display substrate, a packaging method and a display device. The packaging structure for the display substrate includes a base substrate, a light-emitting device arranged on the base substrate, and a packaging thin film covering the light-emitting device. The packaging thin film includes an inorganic thin film and an organic thin film that are laminated, and the organic thin film is arranged on a surface of the inorganic thin film away from the base substrate. The packaging thin film includes a central region and a peripheral region surrounding the central region, the inorganic thin film located in the central region has surface energy greater than that of the inorganic thin film in the peripheral region, and the organic thin film in the central region has a thickness less than that of the organic thin film in the peripheral region.

公开(公告)号：US11513647B2

公开(公告)日：2022-11-29

申请号：US17245134

申请日：2021-04-30

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guoyi Cui ,  Tao Gao ,  Yulin Wang ,  Rui Hou ,  Yinbo Xian

IPC: G06F3/044 ,  H01L27/32

Abstract: A display panel, a method for manufacturing the same and a display device are provided. The display panel includes a substrate and a packaging layer. An edge of a first side of the packaging layer has a first slope. Touch lines are disposed on a side of the packaging layer away from the substrate, an extending direction of at least a portion of the touch lines is crossed with an extending direction of the edge of the packaging layer with the first slope. The touch lines include first lines, second lines and a first insulating layer. The second lines are electrically coupled to the first lines through vias in the first insulating layer. An orthographic projection of at least a portion of the first lines on the substrate is not overlapped with an orthographic projection of a portion of the packaging layer with the first slope on the substrate.

公开(公告)号：US10312316B2

公开(公告)日：2019-06-04

申请号：US15713465

申请日：2017-09-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Yulin Wang ,  Li Sun

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  G02F1/1335 ,  H01L29/08 ,  H01L35/24 ,  H01L51/00

Abstract: A display apparatus includes a display substrate, a package cover plate on the display substrate, and a plurality of FPCs; at one end of the FPC is a driver IC, and the other end of the FPC is connected to the display substrate; a groove is at the edge of the surface away from the display substrate, and the opening direction of the groove deviates from the display substrate; the groove includes a first groove wall, and a second and third groove walls, wherein the first groove wall is located within the package cover plate and the two sides of which are connected to one side of each of the second and third groove walls, respectively, while the other side of each of the second and third groove walls extends to the edge of the package cover plate.