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公开(公告)号：US20230006008A1
公开(公告)日：2023-01-05
申请号：US17772449
申请日：2021-06-16
发明人： Kun MA , Xiaojin ZHANG , Dan WANG , Meng ZHAO , Rongrong GAO
摘要： A display substrate includes a backplane, a pixel defining layer, a gas absorption layer, and light-emitting layers. The pixel defining layer is disposed on a side of the backplane, and has a plurality of openings. The gas absorption layer is disposed on a side of the pixel defining layer away from the backplane, and is configured to absorb a gas generated by the pixel definition layer due to an action of ultraviolet rays. The gas absorption layer exposes at least part of regions of the plurality of openings. The light-emitting layers are each at least partially located in an opening in the plurality of openings.
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公开(公告)号：US20220376199A1
公开(公告)日：2022-11-24
申请号：US17607381
申请日：2020-12-11
发明人： Lei CHEN , Dan WANG , Rongrong GAO
摘要： Provided are an organic light emitting device and a display apparatus. An organic light emitting device, including an anode, a cathode, and an emitting layer disposed between the anode and the cathode; wherein a hole transport layer and an electron blocking layer are disposed between the anode and the emitting layer; the hole transport layer and the electron blocking layer satisfy: |HOMOHTL−HOMOEBL|≤0.2 eV wherein HOMOHTL is a highest occupied molecular orbital, HOMO energy level of the hole transport layer and HOMOEBL is a HOMO energy level of the electron blocking layer.
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公开(公告)号：US20210227198A1
公开(公告)日：2021-07-22
申请号：US16309570
申请日：2018-04-03
发明人： Hongshu ZHANG , Xiaoling XU , Meili WANG , Yun QIU , Dan WANG , Huijuan WANG
摘要： A display system includes: an optical waveguide, which has a first surface and a second surface in parallel with the first surface, wherein the first surface includes a light incident region and a light emergent region, and incident light from the light incident region is propagated in the optical waveguide and then is emitted from the light emergent region; and a squeezed light field module, configured to synthesize a squeezed light field including a displayed image and emit the squeezed light field to the light incident region.
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14.发明申请公开(公告)号：US20210217830A1
公开(公告)日：2021-07-15
申请号：US16092895
申请日：2018-01-10
发明人： Lujiang HUANGFU , Xing FAN , Dan WANG , Xiaowei XU , Liangjian LI
摘要： An OLED display substrate, a manufacturing method thereof and a display device are provided. The OLED display substrate includes a TFT array layer, a first electrode, a pixel definition layer, an OEL layer and a second electrode arranged on a base substrate. The pixel definition layer is configured to define a plurality of subpixel regions. A reflection structure surrounds each subpixel region and is capable of reflecting light beams from the OEL layer and beyond an escaping cone in such a manner as to enable at least parts of the light beams to enter the escaping cone.
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公开(公告)号：US20210211639A1
公开(公告)日：2021-07-08
申请号：US16067318
申请日：2017-12-11
发明人： Yanfeng WANG , Dan WANG , Yun QIU , Zhidong WANG , Xiaoling XU , Yuanxin DU , Zhenhua LV , Congcong WEI , Weipin HU
摘要： The present disclosure belongs to the field of display technology, and particularly relates to a 3D display panel, a method for driving the same and a display apparatus. The 3D display panel is divided into a plurality of pixel regions and comprises a light emitting unit, and the light emitting unit includes a plurality of light emitting devices arranged in the plurality of pixel regions. The plurality of light emitting devices are configured to form a barrier pattern of alternating bright and dark bands during display of the 3D display panel.
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公开(公告)号：US20200209916A1
公开(公告)日：2020-07-02
申请号：US16624076
申请日：2019-04-15
发明人： Xiaojin ZHANG , Dan WANG , Lei CHEN
摘要： A display panel includes: a flexible substrate, and the flexible substrate includes an intermediate region and a preset bending region located at at least one side of a periphery of the intermediate region; a display layer located at a side of the flexible substrate; and a transparent cover film layer located at a side of the display layer away from the flexible substrate, and the transparent cover film layer includes a first portion located at a side of the display layer away from the intermediate region, and a second portion located at a side of the display layer away from the preset bending region. The first portion is connected to the second portion, and the thickness of at least partial region of the second portion progressively decreases in a direction away from the first portion.
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17.发明申请公开(公告)号：US20200050032A1
公开(公告)日：2020-02-13
申请号：US16532676
申请日：2019-08-06
发明人： Dongchuan CHEN , Xueqiang QIAN , Bingyang LIU , Dan WANG , Xinli MA
IPC分类号： G02F1/13 , G02F1/1335
摘要： An anti-peep structure, a method for manufacturing an anti-peep structure, and a display device are provided. The anti-peep structure includes a substrate made of a first material having a first refractive index, the substrate including a light incident surface and a light outgoing surface disposed opposite to each other, where a plurality of grooves are disposed in the substrate at a side of the light incident surface or the light outgoing surface; a second material having a second refractive index disposed in the plurality of grooves; and a refractive index regulating component configured to control the second refractive index; where a viewing angle at the light outgoing surface is determined by a difference between the first refractive index and the second refractive index.
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公开(公告)号：US20190006195A1
公开(公告)日：2019-01-03
申请号：US15951267
申请日：2018-04-12
发明人： Lianjie QU , Yun QIU , Dan WANG , Hebin ZHAO
摘要： A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a re-distribution layer on the wafer for each of the chips; forming each individual chip and the re-distribution layer connected to the chip by cutting; fixing the chip and the re-distribution layer connected thereto to a second panel level substrate; and encapsulating the chip to form an encapsulating layer. A chip encapsulating structure is prepared by the above described chip encapsulating method.
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公开(公告)号：US20170069870A1
公开(公告)日：2017-03-09
申请号：US14914450
申请日：2015-08-10
CPC分类号： H01L51/529 , H01L27/322 , H01L27/3244 , H01L51/5246 , H01L51/56 , H01L2251/308
摘要： The present application provides a display panel, a method for packaging the display panel and a display device. The present application provides a display panel including: a first substrate, a second substrate which is oppositely arranged with respect to the first substrate to form a cell. A sealant layer is arranged between the first substrate and the second substrate, and the first substrate and the second substrate are adhered together by the sealant layer. A first heat conducting pattern is arranged on the first substrate at a position corresponding to a position of the sealant layer, and the first heat conducting pattern is in contact with the sealant layer. The first heat conducting pattern is capable of conducting heat produced by laser during the process of heating the sealant by the laser to form a sealant layer.
摘要翻译： 本申请提供了显示面板，用于包装显示面板的方法和显示装置。 本申请提供了一种显示面板，包括：第一基板，相对于第一基板相对布置以形成单元的第二基板。 密封层设置在第一基板和第二基板之间，第一基板和第二基板通过密封层粘合在一起。 第一导热图案在对应于密封剂层的位置的位置处布置在第一基板上，并且第一导热图案与密封剂层接触。 在通过激光加热密封剂的过程中，第一导热图案能够传导由激光产生的热量以形成密封剂层。
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公开(公告)号：US20160285037A1
公开(公告)日：2016-09-29
申请号：US14761866
申请日：2014-10-30
发明人： Rui HONG , Dan WANG , Seiji FUJINO
CPC分类号： H01L51/5237 , C03C3/142 , C03C3/21 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/18 , C03C12/00 , C08K3/40 , C08K2003/085 , C09D1/00 , C09D5/34 , C09D7/61 , C09D17/002 , C09D17/006 , H01L51/5246
摘要： The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.
摘要翻译： 本发明提供一种包含玻璃粉末和添加剂的玻璃粉末混合物，其中添加剂包括铜粉末，并且基于100质量％的玻璃粉末共混物的总量，铜粉占2-3质量％。 本发明还提供一种玻璃粉末糊剂和光电封装体。 由于向玻璃粉末中添加铜粉末，可以降低玻璃粉末共混物的熔点，从而通过使用激光降低熔融玻璃粉末混合物的温度，并降低在封装期间产生的热应力。
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