公开(公告)号：US20170040430A1

公开(公告)日：2017-02-09

申请号：US14907778

申请日：2015-08-24

Applicant: BOE Technology Group Co. Ltd.

Inventor： Hongwei Tian ,  Kaihong Ma ,  Wenqing Xu ,  Yueping Zuo ,  Xiaowei Xu

IPC: H01L29/423 ,  H01L21/28 ,  H01L29/49 ,  H01L27/12 ,  H01L29/417

CPC classification number: H01L29/42384 ,  H01L21/28008 ,  H01L23/50 ,  H01L27/124 ,  H01L27/3276 ,  H01L29/41 ,  H01L29/41733 ,  H01L29/4908 ,  H01L29/786

Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.

Abstract translation: 导电结构及其制造方法，阵列基板和显示装置。 导电结构包括多个由铝制成的第一金属层，并且在邻近的每两个第一金属层之间，还提供由铝以外的金属制成的第二金属层。 利用导电结构，可以降低导电结构在被加热时发生的小丘现象，而不会降低导电结构的整体厚度。