公开(公告)号：US20050136728A1

公开(公告)日：2005-06-23

申请号：US10741577

申请日：2003-12-19

申请人： Gary Williams ,  Brent Boudreaux ,  Shaun Harris ,  Paul Wirtzberger

发明人： Gary Williams ,  Brent Boudreaux ,  Shaun Harris ,  Paul Wirtzberger

IPC分类号： H01R13/60 ,  H01R13/64

CPC分类号： H01R13/60

摘要： Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.

摘要翻译： 公开了一种用于电子模块组件的布线系统的实施例，其可以包括具有至少一个路由端和形成在所述至少一个路由端的长度上的通道的模块基座，其中所述通道具有允许电线为 从模块基座路由到模块底座外部的连接点，并允许电线沿着连接点的方向在通道内弯曲。

公开(公告)号：US20050132571A1

公开(公告)日：2005-06-23

申请号：US11049346

申请日：2005-02-01

申请人： Eric Peterson ,  Brent Boudreaux ,  Christian Belady

发明人： Eric Peterson ,  Brent Boudreaux ,  Christian Belady

IPC分类号： H05K7/20 ,  F28F23/00 ,  H01L23/36 ,  B21D53/02

CPC分类号： F28F23/00 ,  F28F2013/005 ,  Y10T29/4935

摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.

公开(公告)号：US07567438B1

公开(公告)日：2009-07-28

申请号：US11151763

申请日：2005-06-14

申请人： Stephan Karl Barsun ,  Shaun L Harris ,  Brandon Rubenstein ,  Brent Boudreaux

发明人： Stephan Karl Barsun ,  Shaun L Harris ,  Brandon Rubenstein ,  Brent Boudreaux

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

摘要翻译： 在一个示例中，装置的子组件包括第一主体构件和偏置构件。 延伸穿过子组件的紧固件对组件施加压缩力。 预压构件可与子组件和偏置构件接合，以便向偏置构件施加预压力。 在一个示例中，紧固件是可与螺纹板接合的螺钉，并且被预先压缩的板簧偏压以便于螺钉和螺纹板的初始接合。

公开(公告)号：US20070025088A1

公开(公告)日：2007-02-01

申请号：US11192736

申请日：2005-07-29

申请人： Stephan Barsun ,  Brent Boudreaux ,  Brandon Rubenstein ,  Stephen Cromwell ,  Eric Peterson

发明人： Stephan Barsun ,  Brent Boudreaux ,  Brandon Rubenstein ,  Stephen Cromwell ,  Eric Peterson

IPC分类号： H05K7/20

CPC分类号： H05K7/1092

摘要： A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

摘要翻译： 处理器模块包括处理器和安装在载体上的电压调节器。 电压调节器的触点安装在压缩下，以确保与载体上的焊盘良好的电接触。 分别安装在处理器上的散热片和电压调节器彼此刚性地耦合，以向模块提供刚性，从而保持电压调节器触点的期望的压缩。

公开(公告)号：US20070020984A1

公开(公告)日：2007-01-25

申请号：US11185595

申请日：2005-07-20

申请人： Brent Boudreaux

发明人： Brent Boudreaux

IPC分类号： H01R4/50

CPC分类号： H01R12/89 ,  H05K7/1076

摘要： A socket alignment system comprising a receiving member disposed adjacent to a socket that is operable to receive an electronic component. A slot is disposed on the receiving member and has a longitudinal axis therethrough. An alignment member extends from an electronic component. The alignment member comprises a lower portion and an upper portion. The lower portion is operable to interface with the slot and prevent movement of the electronic component along the longitudinal axis. The upper portion is operable to interface with the slot and allow translational movement of the electronic component along the longitudinal axis.

摘要翻译： 插座对准系统，包括邻近插座设置的接收部件，所述接收部件可操作以接收电子部件。 狭槽设置在接收构件上并且具有穿过其的纵向轴线。 对准构件从电子部件延伸。 对准构件包括下部和上部。 下部可操作以与狭槽相接合并防止电子部件沿着纵向轴线移动。 上部可操作以与狭槽相接合并允许电子部件沿着纵向轴线的平移运动。

公开(公告)号：US20060086481A1

公开(公告)日：2006-04-27

申请号：US10976033

申请日：2004-10-27

申请人： Robert Curtis ,  Brent Boudreaux ,  Christian Belady ,  Eric Peterson ,  Shaun Harris

发明人： Robert Curtis ,  Brent Boudreaux ,  Christian Belady ,  Eric Peterson ,  Shaun Harris

IPC分类号： H05K7/20

CPC分类号： H05K7/20418

摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.

公开(公告)号：US06623303B2

公开(公告)日：2003-09-23

申请号：US09945069

申请日：2001-08-31

申请人： Farrukh S. Syed ,  Eric C. Peterson ,  Richard Schumacher ,  Brent Boudreaux ,  J. Michael Andrewartha ,  Martha G. Peterson

发明人： Farrukh S. Syed ,  Eric C. Peterson ,  Richard Schumacher ,  Brent Boudreaux ,  J. Michael Andrewartha ,  Martha G. Peterson

IPC分类号： H01R903

CPC分类号： H01R13/6485 ,  H01R9/0518

摘要： The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system. In preferred aspects of the invention, the first and second electronic systems are computers; and each of the clamps forms at least one aperture (“clamp aperture”) to affix to a cable coupled to the first electronic system. The invention facilitates configurable cable shield terminations to meet mechanical requirements of a given installation; that is, a single cable construction permits multiple optional clamp attachment locations to accommodate different separations of the attached equipment.