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公开(公告)号：US07450400B2
公开(公告)日：2008-11-11
申请号：US11007095
申请日：2004-12-08
申请人： Brent Boudreaux , Eric Peterson
发明人： Brent Boudreaux , Eric Peterson
CPC分类号： H01L23/4006 , H01L23/3672 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： Various embodiments of an electronic system and method for assembling an electronic system are provided. The electronic system includes an electronic module that is in physical communication with a printed circuit board along a connection area, and the proximal portion and the distal portion of the electronic module, located beyond the connection area, are elevated above the printed circuit board. The electronic system further includes a plurality of securing devices of the proximal portion of the electronic module and at least one securing device that extends through at least one opening of the distal portion of the electronic module to secure the proximal and distal portions of the electronic module to the printed circuit board.
摘要翻译： 提供了一种用于组装电子系统的电子系统和方法的各种实施例。 电子系统包括与连接区域的印刷电路板物理连通的电子模块，位于连接区域之外的电子模块的近端部分和远端部分在印刷电路板的上方升高。 电子系统还包括电子模块的近端部分的多个固定装置和至少一个固定装置，其延伸穿过电子模块的远端部分的至少一个开口，以固定电子模块的近端部分和远端部分 到印刷电路板。
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公开(公告)号：US20050236142A1
公开(公告)日：2005-10-27
申请号：US10832963
申请日：2004-04-26
申请人： Brent Boudreaux
发明人： Brent Boudreaux
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H01L23/367 , F28F3/02 , F28F7/02 , F28F2255/08 , F28F2255/16 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high surface area heat sink results in increased heat transfer to the surrounding air than a similarly sized heat sink with fins. Heat sinks including an array of cylindrical openings may be manufactured through extrusion, stamping, and other common techniques.
摘要翻译： 建立了散热器，其包括用于空气流过而不是翅片的三维阵列的圆柱形开口。 通过具有比具有散热片的散热片更大的表面积，这种高表面积散热器导致与具有翅片的相似尺寸的散热器相比，增加到周围空气的热传递。 包括圆柱形开口阵列的散热片可以通过挤出，冲压和其它常用技术制造。
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公开(公告)号：US07347713B2
公开(公告)日：2008-03-25
申请号：US11185595
申请日：2005-07-20
申请人： Brent Boudreaux
发明人： Brent Boudreaux
IPC分类号： H01R13/64
CPC分类号： H01R12/89 , H05K7/1076
摘要： A socket alignment system comprising a receiving member disposed adjacent to a socket that is operable to receive an electronic component. A slot is disposed on the receiving member and has a longitudinal axis therethrough. An alignment member extends from an electronic component. The alignment member comprises a lower portion and an upper portion. The lower portion is operable to interface with the slot and prevent movement of the electronic component along the longitudinal axis. The upper portion is operable to interface with the slot and allow translational movement of the electronic component along the longitudinal axis.
摘要翻译： 插座对准系统，包括邻近插座设置的接收部件，所述接收部件可操作以接收电子部件。 狭槽设置在接收构件上并且具有穿过其的纵向轴线。 对准构件从电子部件延伸。 对准构件包括下部和上部。 下部可操作以与狭槽相接合并防止电子部件沿着纵向轴线移动。 上部可操作以与狭槽相接合并允许电子部件沿着纵向轴线的平移运动。
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公开(公告)号：US07197806B2
公开(公告)日：2007-04-03
申请号：US11041550
申请日：2005-01-24
CPC分类号： F16B5/0225 , F16B5/02 , F16B13/0891 , F16B43/00 , Y10T29/4984 , Y10T29/49947 , Y10T29/49963 , Y10T403/7064 , Y10T403/7067 , Y10T403/7069 , Y10T403/75 , Y10T403/76
摘要： A fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.
摘要翻译： 一种紧固件组件，包括具有成角度的端部的第一楔形部分，具有成角度的端部的第二楔形部分和延伸穿过第一楔形部分和第二楔形部分的紧固件，其中紧固件的一部分从第一和第 用于与要安装的部件对接的第二楔形部分，其中当紧固件延伸穿过第一楔形部分和第二楔形部分时，第一楔形部分的倾斜端部和第二楔形部分的倾斜端部接合。
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公开(公告)号：US20050219820A1
公开(公告)日：2005-10-06
申请号：US10816550
申请日：2004-04-01
申请人： Christian Belady , Eric Peterson , Brent Boudreaux , Shaun Harris , Roy Zeighami
发明人： Christian Belady , Eric Peterson , Brent Boudreaux , Shaun Harris , Roy Zeighami
CPC分类号： G06F1/20 , G06F2200/201
摘要： In one embodiment, a thermal dissipation system comprises a plurality of thermal members having surfaces adapted for transferring heat from heat generating elements, a heat sink, and a plurality of heat pipes, each of the heat pipes coupled between a respective one of the plurality of thermal members and the heat sink, wherein the plurality of heat pipes possess a sufficient amount of flexibility to enable each of the plurality of thermal members to be disposed over a range of positions relative to the heat sink.
摘要翻译： 在一个实施例中，散热系统包括多个热构件，其具有适于从发热元件传递热量的表面，散热器和多个热管，每个热管耦合在多个 热构件和散热器，其中多个热管具有足够的灵活性，以使多个热构件中的每一个能够相对于散热器设置在一定范围内。
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公开(公告)号：US20060232932A1
公开(公告)日：2006-10-19
申请号：US11107187
申请日：2005-04-15
申请人： Robert Curtis , Roy Zeighami , Christian Belady , Brent Boudreaux
发明人： Robert Curtis , Roy Zeighami , Christian Belady , Brent Boudreaux
IPC分类号： H05K7/20
CPC分类号： F28F21/02 , F28D2021/0029 , H01L21/4882 , H01L23/3672 , H01L23/373 , H01L2224/73253
摘要： Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.
摘要翻译： 实施例包括为电子发热部件提供散热器的装置，方法和系统。 在一个实施例中，散热器包括具有多个凹槽的金属基底和连接到基座的多个石墨翅片。 翅片热量从基部散热并进入周围环境。 翅片通过热膨胀基座而产生的过盈配合固定在凹槽内。
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公开(公告)号：US20060120060A1
公开(公告)日：2006-06-08
申请号：US11007095
申请日：2004-12-08
申请人： Brent Boudreaux , Eric Peterson
发明人： Brent Boudreaux , Eric Peterson
IPC分类号： H05K7/02
CPC分类号： H01L23/4006 , H01L23/3672 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： Various embodiments of an electronic system and method for assembling an electronic system are provided. The electronic system includes an electronic module that is in physical communication with a printed circuit board along a connection area, and the proximal portion and the distal portion of the electronic module, located beyond the connection area, are elevated above the printed circuit board. The electronic system further includes a plurality of securing devices of the proximal portion of the electronic module and at least one securing device that extends through at least one opening of the distal portion of the electronic module to secure the proximal and distal portions of the electronic module to the printed circuit board.
摘要翻译： 提供了一种用于组装电子系统的电子系统和方法的各种实施例。 电子系统包括与连接区域的印刷电路板物理连通的电子模块，位于连接区域之外的电子模块的近端部分和远端部分在印刷电路板的上方升高。 电子系统还包括电子模块的近端部分的多个固定装置和至少一个固定装置，其延伸穿过电子模块的远端部分的至少一个开口，以固定电子模块的近端部分和远端部分 到印刷电路板。
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公开(公告)号：US20050152117A1
公开(公告)日：2005-07-14
申请号：US11030774
申请日：2005-01-06
申请人： Christian Belady , Shaun Harris , Gary Williams , Brent Boudreaux
发明人： Christian Belady , Shaun Harris , Gary Williams , Brent Boudreaux
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US20060133043A1
公开(公告)日：2006-06-22
申请号：US11023213
申请日：2004-12-22
申请人： Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
发明人： Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
IPC分类号： H05K7/20
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译： 具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。 散热器和第二PCB基本上围绕其中的第一PCB。
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公开(公告)号：US20050191149A1
公开(公告)日：2005-09-01
申请号：US11041550
申请日：2005-01-24
CPC分类号： F16B5/0225 , F16B5/02 , F16B13/0891 , F16B43/00 , Y10T29/4984 , Y10T29/49947 , Y10T29/49963 , Y10T403/7064 , Y10T403/7067 , Y10T403/7069 , Y10T403/75 , Y10T403/76
摘要： Disclosed is a fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.
摘要翻译： 公开了一种紧固件组件，其包括具有成角度的端部的第一楔形部分，具有成角度的端部的第二楔形部分和延伸穿过第一楔形部分和第二楔形部分的紧固件，其中紧固件的一部分从 第一楔形部分和第二楔形部分，用于与要安装的部件接合，其中当紧固件延伸穿过第一楔形部分和第二楔形部分时，第一楔形部分的倾斜端部和第二楔形部分的倾斜端部接合。
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