PERMANENT BONDING AND PATTERNING MATERIAL

    公开(公告)号:US20210033975A1

    公开(公告)日:2021-02-04

    申请号:US16945542

    申请日:2020-07-31

    Abstract: Methods are disclosed to prepare permanent materials that can be coated onto microelectronic substrates or used for other structural or optical applications. The materials are thermally stable to at least about 300° C., curable using a photo or thermal process, exhibit good chemical resistance (including during metal passivation), and have a lifespan of at least about 5 years, preferably at least about 10 years, in the final device. Advantageously, these materials can also be bonded at room temperature. The materials exhibit no movement or squeeze-out after bonding and adhere to a variety of substrate types.

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