公开(公告)号：US20210332188A1

公开(公告)日：2021-10-28

申请号：US17241174

申请日：2021-04-27

Applicant: Brewer Science, Inc.

Inventor： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

IPC: C08G73/00 ,  C09J179/00 ,  B32B43/00 ,  B32B7/12 ,  B32B17/06 ,  H01L21/683

Abstract: The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

公开(公告)号：US20200234993A1

公开(公告)日：2020-07-23

申请号：US16747271

申请日：2020-01-20

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  B32B43/00 ,  H01L21/56

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US20190194453A1

公开(公告)日：2019-06-27

申请号：US16229591

申请日：2018-12-21

Applicant: Brewer Science, Inc.

Inventor： Xiao Liu ,  Qi Wu ,  Rama Puligadda ,  Dongshun Bai ,  Baron Huang

IPC: C08L71/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528

CPC classification number: C08L71/12 ,  C08L2203/20 ,  H01L23/3114 ,  H01L23/528 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/02379

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：US09827740B2

公开(公告)日：2017-11-28

申请号：US14805898

申请日：2015-07-22

Applicant: Brewer Science Inc.

Inventor： Xiao Liu ,  Dongshun Bai ,  Tony D. Flaim ,  Xing-Fu Zhong ,  Qi Wu

IPC: B32B38/10 ,  B32B7/06 ,  B05D3/00 ,  B32B27/06 ,  B32B37/14 ,  C09D179/08 ,  H01L21/683 ,  C08G73/10

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

公开(公告)号：US20160023436A1

公开(公告)日：2016-01-28

申请号：US14805898

申请日：2015-07-22

Applicant: Brewer Science Inc.

Inventor： Xiao Liu ,  Dongshun Bai ,  Tony D. Flaim ,  Xing-Fu Zhong ,  Qi Wu

IPC: B32B7/06 ,  B32B37/14 ,  B32B27/06 ,  B05D3/00

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract translation: 本发明广泛地涉及在微电子制造期间能够实现薄晶片处理的释放层组合物。 优选的剥离层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟， 薄膜。 该方法将释放组合物形成为可用于临时粘合工艺的聚酰亚胺剥离层，并且在所需的加工已经进行之后激光剥离。

公开(公告)号：US12024594B2

公开(公告)日：2024-07-02

申请号：US17241174

申请日：2021-04-27

Applicant: Brewer Science, Inc.

Inventor： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

IPC: C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/00 ,  C09J179/00 ,  H01L21/683

CPC classification number: C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/006 ,  C09J179/00 ,  H01L21/6835 ,  B32B2307/412 ,  B32B2457/00 ,  H01L2221/68381

Abstract: The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

公开(公告)号：US20230187257A1

公开(公告)日：2023-06-15

申请号：US18162028

申请日：2023-01-31

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

CPC classification number: H01L21/6835 ,  C08G73/026 ,  H01L21/568 ,  B32B43/006 ,  B32B2457/00

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US10968348B2

公开(公告)日：2021-04-06

申请号：US16229591

申请日：2018-12-21

Applicant: Brewer Science, Inc.

Inventor： Xiao Liu ,  Qi Wu ,  Rama Puligadda ,  Dongshun Bai ,  Baron Huang

IPC: C08L71/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L21/48 ,  C08K3/00 ,  H01L21/683

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：US11610801B2

公开(公告)日：2023-03-21

申请号：US16747271

申请日：2020-01-20

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.