公开(公告)号：US20170040200A1

公开(公告)日：2017-02-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andy Wong

IPC: H01L21/683 ,  C08G77/14 ,  C08G77/20 ,  C09J7/02 ,  C08G77/26 ,  C09J5/04 ,  C09J145/00 ,  C09J183/06 ,  H01L21/50 ,  C08G77/18

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US20190194453A1

公开(公告)日：2019-06-27

申请号：US16229591

申请日：2018-12-21

Applicant: Brewer Science, Inc.

Inventor： Xiao Liu ,  Qi Wu ,  Rama Puligadda ,  Dongshun Bai ,  Baron Huang

IPC: C08L71/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528

CPC classification number: C08L71/12 ,  C08L2203/20 ,  H01L23/3114 ,  H01L23/528 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/02379

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：US09865490B2

公开(公告)日：2018-01-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andrew Wong

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/50 ,  C08G77/14 ,  C08G77/20 ,  C08G77/18 ,  C08G77/26 ,  C09J145/00 ,  C09J183/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  C09J5/06

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

公开(公告)号：US10968348B2

公开(公告)日：2021-04-06

申请号：US16229591

申请日：2018-12-21

Applicant: Brewer Science, Inc.

Inventor： Xiao Liu ,  Qi Wu ,  Rama Puligadda ,  Dongshun Bai ,  Baron Huang

IPC: C08L71/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L21/48 ,  C08K3/00 ,  H01L21/683

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.