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公开(公告)号：US20190262678A1
公开(公告)日：2019-08-29
申请号：US16407594
申请日：2019-05-09
申请人： Michael Jolley
发明人： Michael Jolley , Kenneth Courian
摘要： Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.
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公开(公告)号：US10369440B2
公开(公告)日：2019-08-06
申请号：US16197176
申请日：2018-11-20
申请人： Michael Jolley
发明人： Michael Jolley , Kenneth Courian
摘要： Golf tool devices and golf clubs having those devices attached to, or incorporated with, their grips are disclosed. In some embodiments, the golf tool device includes a housing and a tool assembly attached to the housing. The tool assembly includes a base jaw and a gripper jaw pivotably connected to the base jaw. The tool assembly additionally includes a spring connected to the gripper jaw and configured to urge the gripper jaw toward the base jaw. The golf tool device additionally includes a mode selector assembly configured to selectively switch operation of the gripper jaw between at least two modes. The at least two modes include a first mode in which the gripper jaw moves in response to urging of the spring, and a second mode in which the gripper jaw is secured in a first position that is spaced away from the base jaw against urging of the spring.
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公开(公告)号：US07514944B2
公开(公告)日：2009-04-07
申请号：US12075341
申请日：2008-03-10
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R1/07371
摘要： A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.
摘要翻译： 探头，其包括当弹性膜的一个表面之一变形时能够发挥恢复力的弹性膜。 导电探针包括具有第一端和第二端的梁，探针尖靠近第一端以接触待测器件。 靠近梁的第二端的梁接触。 梁可移动以使弹性膜的至少一个表面变形。
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公开(公告)号：US20060006889A1
公开(公告)日：2006-01-12
申请号：US11175600
申请日：2005-07-05
申请人： Kenneth Smith , Michael Jolley , Victoria Syckel
发明人： Kenneth Smith , Michael Jolley , Victoria Syckel
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R1/07371
摘要： A probe head with membrane suspended probes.
摘要翻译： 探针头与膜悬浮探针。
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公开(公告)号：US06394106B1
公开(公告)日：2002-05-28
申请号：US09649228
申请日：2000-08-28
申请人： Michael Jolley
发明人： Michael Jolley
IPC分类号： B08B304
CPC分类号： C11D3/044 , B08B3/08 , C11D1/83 , C11D3/30 , C11D11/0047 , C11D11/0064 , C11D11/007
摘要： A mixture for cleaning slurries left on the surface of a semiconductor wafer, after a polishing step, includes a caustic, an anionic surfactant, a non-ionic surfactant, and water. The caustic provides an etch rate on the surface to be cleaned in the range of 1-100 Angstroms per minute. The ionic concentration of the caustic ranges from 0.5N to 0.000001N. The caustic etches the surface. The anionic surfactant prevents particle redeposition. The non-ionic surfactant inhibits pitting of the backside of the wafers, if they have exposed silicon or polysilicon.
摘要翻译： 在抛光步骤之后，残留在半导体晶片表面上的浆料的混合物包括苛性碱，阴离子表面活性剂，非离子表面活性剂和水。 苛性碱在1-100埃每分钟范围内提供待清洗表面的蚀刻速率。 苛性碱的离子浓度范围为0.5N至0.000001N。 苛性碱蚀刻表面。 阴离子表面活性剂防止颗粒再沉积。 如果非离子表面活性剂具有暴露的硅或多晶硅，则非离子表面活性剂抑制晶片背面的点蚀。
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公开(公告)号：US06217667B1
公开(公告)日：2001-04-17
申请号：US09406908
申请日：1999-09-24
申请人： Michael Jolley
发明人： Michael Jolley
IPC分类号： B08B500
CPC分类号： H01L21/02074 , C23G1/20 , H01L21/02063 , Y10S134/902
摘要： In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to the copper surface. The copper etch rate is greatly reduced. The method is useful in removing residual polishing slurry after a chemical-mechanical polishing step, and for removing residues left in via holes after plasma etching.
摘要翻译： 在清洁半导体晶片或制品的铜表面的方法中，氮气鼓泡或溶解在强碱性溶液中，从溶液中排出溶解氧。 在铜表面上提供氮气环境。 然后将碱性溶液施加到铜表面。 铜蚀刻速率大大降低。 该方法可用于在化学 - 机械抛光步骤之后去除残留的抛光浆料，并且用于在等离子体蚀刻之后去除通孔中留下的残留物。
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公开(公告)号：US20080157795A1
公开(公告)日：2008-07-03
申请号：US12075341
申请日：2008-03-10
IPC分类号： G01R1/073
CPC分类号： G01R1/0735 , G01R1/07371
摘要： A probe head with membrane suspended probes.
摘要翻译： 探针头与膜悬浮探针。
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公开(公告)号：US06632288B2
公开(公告)日：2003-10-14
申请号：US09816707
申请日：2001-03-23
申请人： Michael Jolley
发明人： Michael Jolley
IPC分类号： B08B704
CPC分类号： H01L21/02074 , C23G1/20 , H01L21/02063 , Y10S134/902
摘要： In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to the copper surface. The copper etch rate is greatly reduced. The method is useful in removing residual polishing slurry after a chemical-mechanical polishing step, and for removing residues left in via holes after plasma etching.
摘要翻译： 在清洁半导体晶片或制品的铜表面的方法中，氮气鼓泡或溶解在强碱性溶液中，从溶液中排出溶解氧。 在铜表面上提供氮气环境。 然后将碱性溶液施加到铜表面。 铜蚀刻速率大大降低。 该方法可用于在化学 - 机械抛光步骤之后去除残留的抛光浆料，并且用于在等离子体蚀刻之后去除留在通孔中的残留物。
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