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    Probe head for reduced-pitch applications
    1.
    发明授权
    Probe head for reduced-pitch applications 有权

    公开(公告)号：US11953522B2

    公开(公告)日：2024-04-09

    申请号：US17783440

    申请日：2020-12-17

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Roberto Crippa ,  Stefano Felici

    IPC: G01R1/073 ,  G01R1/067 ,  G01R31/28

    CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2889

    Abstract: A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

    Fluid pressure activated electrical contact devices and methods
    2.
    发明授权
    Fluid pressure activated electrical contact devices and methods 有权

    公开(公告)号：US10003149B2

    公开(公告)日：2018-06-19

    申请号：US15793270

    申请日：2017-10-25

    Applicant: ComponentZee, LLC

    Inventor： Masud Beroz

    IPC: G01R31/20 ,  H01R13/24 ,  G01R31/28 ,  F15B15/10

    CPC classification number: H01R13/2428 ,  F15B15/10 ,  G01R1/0735 ,  G01R31/2884 ,  H01H35/26 ,  H01H2221/002

    Abstract: A contactor device includes: a first body substrate; a second body substrate; a flexible membrane connected to the first body substrate and second body substrate, wherein the second substrate body is movable relative to the first substrate body by flexure of the flexible membrane; an electrical contact member carried by the second substrate body; a microfluidic-channeled substrate coupled to the first body substrate, the microfluidic-channeled substrate having a chamber and a microfluidic channel in fluid communication with the chamber; and a 3-dimensional flexible membrane enclosing the chamber, wherein the 3-dimensional flexible membrane flexes toward the second body substrate when a fluid pressure is applied to the chamber through the microfluidic channel whereby a force or a movement is transferred to the second body substrate by the 3-dimensional flexible membrane.

    Wafer testing probe card
    4.
    发明授权
    Wafer testing probe card 有权

    公开(公告)号：US09823272B2

    公开(公告)日：2017-11-21

    申请号：US14162766

    申请日：2014-01-24

    Applicant: MPI Corporation

    Inventor： Ming-Chi Chen ,  Tien-Chia Li ,  Dai-Jin Yeh ,  Tsung-Yi Chen ,  Chien-Kuei Wang

    IPC: G01R31/02 ,  G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/0735 ,  G01R1/06733 ,  G01R1/07314

    Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

    PROBE PIN
    6.
    发明申请
    PROBE PIN 审中-公开

    公开(公告)号：US20170115324A1

    公开(公告)日：2017-04-27

    申请号：US15317200

    申请日：2015-06-04

    Applicant: OMRON Corporation

    Inventor： Hirotada TERANISHI ,  Takahiro SAKAI

    IPC: G01R1/067

    CPC classification number: G01R1/06722 ,  G01R1/0483 ,  G01R1/067 ,  G01R1/06738 ,  G01R1/07342 ,  G01R1/0735 ,  G01R1/07378

    Abstract: A probe pin includes a coil spring, a first plunger, a first end of which is inserted from a first end of the coil spring into the coil spring and a second end of which is exposed to outside of the coil spring, and a second plunger, a first end of which is inserted from a second end of the coil spring into the coil spring to be in contact with the first end of the first plunger and a second end of which is exposed to the outside of the coil spring. The second plunger includes at least one elastic arm extending from the second end of the second plunger, and a touch portion is provided at a leading end of the elastic arm and displaceable in a direction intersecting an axial center direction when pressing force in the axial center direction is applied to the touch portion.

    FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING POST(S) FOR INTEGRATED CIRCUIT (IC) BUMP(S) ELECTRICAL TESTING, AND RELATED METHODS AND TESTING APPARATUSES
    7.
    发明申请
    FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING POST(S) FOR INTEGRATED CIRCUIT (IC) BUMP(S) ELECTRICAL TESTING, AND RELATED METHODS AND TESTING APPARATUSES 审中-公开
    用于集成电路（IC）电气测试的导电耦合端子的柔性薄膜电测试基板及其相关方法和测试装置

    公开(公告)号：US20160091532A1

    公开(公告)日：2016-03-31

    申请号：US14498291

    申请日：2014-09-26

    Applicant: QUALCOMM Incorporated

    Inventor： Young Kyu Song ,  Hong Bok We ,  Dong Wook Kim ,  Chin-Kwan Kim ,  Jae Sik Lee ,  Kyu-Pyung Hwang ,  Seung Hyuk Kang

    IPC: G01R1/073 ,  H01L21/66 ,  H01L21/48 ,  G01R31/28

    CPC classification number: G01R1/0735 ,  G01R1/07378 ,  G01R31/2887 ,  H01L21/4853 ,  H01L21/4857 ,  H01L22/30

    Abstract: Flexible film electrical-test substrates with at least one conductive contact post for integrated circuit (IC) bump(s) electrical testing, and related methods and testing apparatuses are disclosed. The backside structure of an electrical-test substrate comprises a flexible dielectric film structure. One or more fine-pitched conductive coupling posts are formed on conductive pads disposed on a front side of the flexible dielectric film structure through a fabrication process. A first pitch of the conductive coupling post(s) in the flexible dielectric film structure is provided to be the same or substantially the same as a second pitch of one or more bumps in an IC, such as die or interposer (e.g., forty (40) micrometers (μm) or less). This allows the conductive coupling post(s) to be placed into mechanical contact with at least one bump of the IC, point-by-point, during an electrical test to electrically testing of the IC.

    Abstract translation: 公开了具有至少一个用于集成电路（IC）凸点电气测试的导电接触柱的柔性膜电测基板，以及相关方法和测试装置。 电测基板的背面结构包括柔性介电膜结构。 通过制造工艺，在设置在柔性电介质膜结构的前侧的导电焊盘上形成一个或多个细间距导电耦合柱。 将柔性电介质膜结构中的导电耦合柱的第一间距设置成与IC中的一个或多个凸起的第二间距相同或基本相同，例如模具或插入件（例如，40（ 40微米（μm）以下）。 这允许导电耦合柱在电测试期间被放置成与IC的至少一个凸点相接触，以电IC测试。

    Socket and electronic device test apparatus
    8.
    发明授权
    Socket and electronic device test apparatus 有权
    插座和电子设备测试仪器

    公开(公告)号：US09250263B2

    公开(公告)日：2016-02-02

    申请号：US14618070

    申请日：2015-02-10

    Applicant: ADVANTEST CORPORATION

    Inventor： Kiyoto Nakamura ,  Takashi Fujisaki

    IPC: G01R31/00 ,  G01R1/04 ,  G01R31/26 ,  G01R1/073 ,  G01R31/28

    CPC classification number: G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0735 ,  G01R31/2601 ,  G01R31/2886

    Abstract: A socket is electrically connected to a test carrier. The test carrier includes a film-shaped first member on which at least one internal terminal, which contacts at least one electrode of an electronic device, is provided; and at least one external terminal which is electrically connected to the internal terminal. The socket includes: at least one contactor which contacts the external terminal; and a first pusher which pushes a portion of the first member where the internal terminal is provided and a portion of the first member surrounding the internal terminal. The first pusher includes: a bag member which has a sealed space within the bag member; and a fluid which is housed in the sealed space.

    Abstract translation: 插座电连接到测试载体。 测试载体包括薄膜状的第一构件，在其上提供与电子设备的至少一个电极接触的至少一个内部端子; 以及与内部端子电连接的至少一个外部端子。 插座包括：至少一个接触外部端子的接触器; 以及第一推动器，其推动设置有内部端子的第一构件的一部分和围绕内部端子的第一构件的一部分。 第一推动器包括：袋构件，其在袋构件内具有密封空间; 以及容纳在密封空间中的流体。

    Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
    10.
    发明授权
    Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same 有权
    弹性电插入件，包括插入件的系统，以及使用和形成插入件的方法

    公开(公告)号：US08970240B2

    公开(公告)日：2015-03-03

    申请号：US13287794

    申请日：2011-11-02

    Applicant: Kenneth R. Smith ,  Mike Jolley ,  Eric Strid ,  Peter Hanaway ,  K. Reed Gleason ,  Koby L. Duckworth

    Inventor： Kenneth R. Smith ,  Mike Jolley ,  Eric Strid ,  Peter Hanaway ,  K. Reed Gleason ,  Koby L. Duckworth

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/0735 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/4857 ,  Y10T29/49155

    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

    Abstract translation: 可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件，以及可利用弹性电插入件及其使用和/或制造方法的系统。 弹性电插入件可以包括弹性介电体，其中包含多个电导管。 多个电导管可以被配置为在电插入器的第一表面和/或弹性介电体之间提供多个电连接，以及电插入器和/或弹性介电体的第二相对的表面。 本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性，改进的接触力控制和/或改进的尺寸稳定性。

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