Abstract:
A lead frame (100) of a light emitting diode (LED) comprises a housing (2) and a plurality of electrodes (1) arranged in the housing (2). The housing (2) has a cavity (21) with an inner circumferential surface for reflecting light from a LED chip mounted in the cavity (21). The inner circumferential surface is coated with a reflective coat (22) having a plurality of ultraviolet light reflective particles (23).
Abstract:
A socket assembly, comprising a socket, a package received in the socket, a pressing member arranged upon the package and downwardly pressing the package and two heat pipes attached to the pressing member. The pressing member is formed with four arch grooves along a peripheral thereof, and the arch grooves allow linking members to pass therethrough and rotatablely retain the pressing member on a printed circuit board. Therefore, the pressing member can rotate in a certain range, by sliding the arch groove with respect to the linking member, to provide a flexible arrangement for heat pipes.