公开(公告)号：US11905202B2

公开(公告)日：2024-02-20

申请号：US16875207

申请日：2020-05-15

Applicant: Corning Incorporated

Inventor： Yuhui Jin ,  Taylor Marie Wilkinson

IPC: C03C15/02 ,  C03C21/00

CPC classification number: C03C15/02 ,  C03C21/002

Abstract: A method of modifying a glass substrate comprises: generating surface features with peaks and valleys on a first surface of a glass substrate, the surface features providing a roughness average (Ra) within the range of 10 nm to 2000 nm; generating a region of the glass substrate that is under compressive stress, the region extending from the first surface to a depth of compression; and removing a portion of the region under compressive stress from the first surface into the depth of compression to define a new first surface still having surface features with peaks and valleys providing a roughness average (Ra) within the range of 10 nm to 2000 nm. Removing the portion of the region under compressive stress from the first surface into the depth of the compression to define a new first surface can comprise contacting the first surface with a light etchant.

公开(公告)号：US20190300426A1

公开(公告)日：2019-10-03

申请号：US16369613

申请日：2019-03-29

Applicant: CORNING INCORPORATED

Inventor： Qiang Fu ,  Jennifer Lynn Hunt ,  Rostislav Vatchev Roussev ,  Charlene Marie Smith ,  Alana Marie Whittier ,  Taylor Marie Wilkinson

IPC: C03C21/00 ,  H05K5/03 ,  C03C10/00

Abstract: Disclosed herein are glass-ceramic article having a first surface, a second surface opposing the first surface, a first region extending from the first surface to a first depth d1, and a second region extending from a depth greater than or equal to d1 to a second depth d2, wherein the second region comprises a crystalline phase and a glass phase, and wherein an area percentage % of crystals in the first region is less than an area percentage % of crystals in the second region. In some embodiments, a compressive stress layer extends from the first surface to a depth of compression (DOC), wherein the DOC is greater than or equal to 0.05 mm an average compressive stress in the first region is greater than or equal to 50 MPa. In some embodiments, the DOC is greater than d1; a reduce modulus of the first region is less than the reduced modulus of the second region; and/or a hardness of the first region is less than the hardness of the second region.