公开(公告)号：US08703562B2

公开(公告)日：2014-04-22

申请号：US13426832

申请日：2012-03-22

Applicant: Tzung-Han Lee ,  Chung-Lin Huang ,  Ron-Fu Chu

Inventor： Tzung-Han Lee ,  Chung-Lin Huang ,  Ron-Fu Chu

IPC: H01L21/8238

CPC classification number: H01L27/10894 ,  H01L27/10823 ,  H01L27/10876 ,  H01L27/10885

Abstract: A manufacturing method of a random access memory includes the following steps: providing a semiconductor structure having an array region and a peripheral region; forming a plurality of first trenches in the array region, and concurrently, a plurality of second trenches on the peripheral region; forming a polysilicon layer to cover the array region and the peripheral region, and the first and the second trenches are filled up with the polysilicon layer; planarizing the polysilicon layer so the remaining polysilicon layer only resides in the first and the second trenches; forming a conductive layer on the semiconductor structure; patterning the conductive layer to form a plurality of landing pads on the array region, and a plurality of bit line units on the peripheral region; and forming a plurality of capacitor units which is in electrical connection to the landing pads.

Abstract translation: 随机存取存储器的制造方法包括以下步骤：提供具有阵列区域和周边区域的半导体结构; 在阵列区域中形成多个第一沟槽，同时在周边区域上形成多个第二沟槽; 形成多晶硅层以覆盖阵列区域和外围区域，并且第一和第二沟槽被多晶硅层填充; 平坦化多晶硅层，使得剩余的多晶硅层仅驻留在第一和第二沟槽中; 在半导体结构上形成导电层; 图案化导电层以在阵列区域上形成多个着陆焊盘，以及在周边区域上形成多个位线单元; 以及形成与所述着陆焊盘电连接的多个电容器单元。

公开(公告)号：US5857127A

公开(公告)日：1999-01-05

申请号：US932622

申请日：1997-09-17

Applicant: Ron-Fu Chu

Inventor： Ron-Fu Chu

IPC: G03F7/30 ,  H01L21/027 ,  G03D5/00

CPC classification number: G03F7/3021

Abstract: An apparatus for use in the photoresist development process of an integrated circuit fabrication is provided to improve the uniformity of development. The apparatus includes: a holder which includes a vertical spindle and a chuck fixed on the top of the vertical spindle, for horizontally holding a semiconductor wafer; a liquid feeder disposed above the holder, for supplying a developer onto the semiconductor wafer; a cup-type housing disposed under the holder, wherein the bottom of the cup-type housing includes a valve for draining the developer and a hole for allowing the vertical spindle to penetrate through; and a hoisting instrument fixed on the bottom of the cup-type housing, so that when the cup-type housing is lifted, the edge of the semiconductor wafer tightly contacts the sidewall of the cup-type housing, thereby forming a dish-like container for containing the developer.

Abstract translation: 提供了用于集成电路制造的光致抗蚀剂显影处理中的装置，以提高显影的均匀性。 该装置包括：保持器，其包括垂直主轴和固定在垂直主轴顶部上的卡盘，用于水平地保持半导体晶片; 设置在所述保持器上方的用于将显影剂供应到所述半导体晶片上的液体进料器; 设置在所述保持器下方的杯型壳体，其中所述杯型壳体的底部包括用于排出所述显影剂的阀和用于允许所述垂直心轴穿过的孔; 以及固定在杯型壳体的底部的起重工具，使得当杯形壳体被提起时，半导体晶片的边缘紧密接触杯形壳体的侧壁，从而形成盘状容器 用于包含开发者。

公开(公告)号：US5734594A

公开(公告)日：1998-03-31

申请号：US719384

申请日：1996-09-25

Applicant: Ron-Fu Chu ,  Zadig Cheung-Ching Lam

Inventor： Ron-Fu Chu ,  Zadig Cheung-Ching Lam

IPC: G03F9/00 ,  G01B7/00

CPC classification number: G03F9/70

Abstract: This computer system, as well as its method of operation, corrects the position data used to define the location of alignment marks on a workpiece. The first step is to scan marks along a first direction to determine the direction of wafer scaling along the first direction. Second, scan marks along a second direction to determine the direction of wafer scaling along the second direction. Next, scan a first set of alignment marks on a workpiece oriented in a first direction and a second set of alignment marks on the workpiece oriented in a second direction in an initial sequence to collect initial direction data on the location. Then, scan the first set of alignment marks and the second set of alignment marks in a reverse sequence to collect reverse direction data on the location. Finally, average the initial direction data and the reverse direction data. This enables correction of false alignment data attributable to falsely measured locations of alignment marks.

Abstract translation: 该计算机系统及其操作方法校正用于定义工件上对准标记位置的位置数据。 第一步是沿着第一方向扫描标记，以确定沿着第一方向的晶片缩放的方向。 其次，沿着第二方向扫描标记以确定沿着第二方向的晶片缩放的方向。 接下来，扫描沿着第一方向定向的工件上的第一组对准标记，以及以初始顺序在第二方向上取向的工件上的第二组对准标记，以收集位置上的初始方向数据。 然后，以相反的顺序扫描第一组对准标记和第二组对准标记，以收集位置上的反向数据。 最后，平均初始方向数据和反向数据。 这使得能够校正归因于对准标记的错误测量位置的错误对准数据。