公开(公告)号：US20130264184A1

公开(公告)日：2013-10-10

申请号：US13759058

申请日：2013-02-05

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: H03K17/96

CPC classification number: H03K17/962 ,  H03K17/975

Abstract: A capacitive touch device includes a first transparent substrate, a second transparent substrate and an adhesive layer connecting the first and second transparent substrates with each other. The first transparent substrate has a first side and a second side. A first conductive layer is disposed on the second side. The second transparent substrate has a third side and a fourth side. A second conductive layer is selectively disposed on the third side or the fourth side. The adhesive layer is disposed between the first transparent substrate and the second transparent substrate. By means of the design of the capacitive touch device, the thickness of the touch device is greatly reduced and the manufacturing cost is lowered.

公开(公告)号：US20130264183A1

公开(公告)日：2013-10-10

申请号：US13759057

申请日：2013-02-05

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: H03K17/96

CPC classification number: G06F3/044 ,  B32B17/064 ,  B32B27/304 ,  B32B27/32 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  H03K17/962

Abstract: A capacitive touch unit includes a transparent substrate, a polymeric transparent substrate, a second conductive layer and an adhesive layer. The transparent substrate is coated with at least one first conductive layer and is correspondingly attached to the polymeric transparent substrate. The second conductive layer is selectively disposed on one of two sides of the polymeric transparent substrate. The adhesive layer is disposed between the transparent substrate and the polymeric transparent substrate. By means of the capacitive touch unit, the thickness can be greatly reduced and the manufacturing cost can be greatly lowered.

Abstract translation: 电容式触摸单元包括透明基板，聚合物透明基板，第二导电层和粘合剂层。 透明基底涂覆有至少一个第一导电层，并且相应地连接到聚合物透明基底上。 第二导电层选择性地设置在聚合物透明基底的两侧之一上。 粘合剂层设置在透明基材和聚合物透明基材之间。 通过电容式触摸单元，能够大幅度减小厚度，能够大幅降低制造成本。

公开(公告)号：US20110066386A1

公开(公告)日：2011-03-17

申请号：US12560836

申请日：2009-09-16

Applicant: Chien-Chong Hong ,  Po-Hsiang Chang ,  Chih-Chung Lin

Inventor： Chien-Chong Hong ,  Po-Hsiang Chang ,  Chih-Chung Lin

IPC: G06F19/00 ,  H01L31/12

CPC classification number: G01N21/05 ,  G01N21/253 ,  G01N21/77 ,  G01N2021/0346 ,  G01N2021/058

Abstract: The invention discloses an anesthetic sensing optical microfluidic chip system. The anesthetic sensing optical microfluidic chip system includes a biochip, a light source, and a detector. The biochip includes a substrate, a micro-channel, and a molecularly imprinted biosensor. The micro-channel is bonded beyond the substrate. The molecularly imprinted biosensor is disposed in the micro-channel, and a surface of the molecularly imprinted biosensor has a plurality of imprinted sites. When a sample including a plurality of anesthetic molecules is injected into the micro-channel and flowing through the surface of the molecularly imprinted biosensor, some of the anesthetic molecules are captured by the imprinted sites. The light source emits a sensing light to the plastic biochip, and the detector receives the sensing light passing through the imprinted sites on the surface of the molecularly imprinted biosensor and generates a detecting result based on the received sensing light.

Abstract translation: 本发明公开了一种麻醉感应光学微流体芯片系统。 麻醉感测光学微流体芯片系统包括生物芯片，光源和检测器。 生物芯片包括底物，微通道和分子印迹生物传感器。 微通道粘合在基底之外。 分子印迹生物传感器设置在微通道中，分子印迹生物传感器的表面具有多个印迹位点。 当将包含多个麻醉分子的样品注入微通道并流过分子印迹生物传感器的表面时，一些麻醉分子被印迹位点捕获。 光源向塑料生物芯片发射感测光，并且检测器接收通过分子印迹生物传感器表面上的印记位点的感测光，并基于接收到的感测光产生检测结果。

公开(公告)号：USD311363S

公开(公告)日：1990-10-16

申请号：US183034

申请日：1988-04-18

Applicant: Chih-Chung Lin

Designer： Chih-Chung Lin

公开(公告)号：US09898644B2

公开(公告)日：2018-02-20

申请号：US14548297

申请日：2014-11-20

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A touch panel with fingerprint identification function includes a glass substrate, a fingerprint identification device, a packaging layer, an optical adhesive layer and a sealing layer. The glass substrate has a visible section, a non-visible section and a first plane face. The non-visible section is formed with a recess having a bottom side. The fingerprint identification device is disposed in the recess, having a substrate having a first side. A silicon substrate is disposed on the first side and electrically connected to the substrate via a wire. Multiple fingerprint identification chips are disposed on one side of the silicon substrate. The packaging layer encloses the wire, the substrate and an exposed section of the silicon substrate. The optical adhesive layer is disposed between the fingerprint identification device and the bottom side of the recess. The sealing layer seals the fingerprint identification device in the recess of the glass substrate.

公开(公告)号：US09727771B2

公开(公告)日：2017-08-08

申请号：US14685603

申请日：2015-04-14

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: G06F3/041 ,  G06F3/044 ,  G06K9/00

CPC classification number: G06K9/00033 ,  G06F3/041 ,  G06F3/044 ,  G06K9/00013 ,  G06K9/22

Abstract: A touch device with fingerprint identification function includes a glass substrate having a first and a second face, a first electrode layer having multiple first electrodes, an insulation layer, a second electrode layer having multiple second electrodes, a wiring layer, a film layer covering the second electrode layer and the wiring layer, and a fingerprint identification sensation layer having multiple fingerprint identification chips and multiple transmission leads. The first face is defined with a touch section and a non-touch section. The first electrode layer is disposed on the second face. One face of the insulation layer covers the first electrode layer. The second electrode layer is disposed on the other face of the insulation layer. The wiring layer is disposed at the non-touch section and selectively electrically connected to the first and second electrode layers. The touch device is able to lower manufacturing cost and enhance fingerprint identification precision.

公开(公告)号：US20160188033A1

公开(公告)日：2016-06-30

申请号：US14583110

申请日：2014-12-25

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: G06F3/044 ,  G06F3/041 ,  G06K9/00

CPC classification number: G06F3/044 ,  G06F3/0416 ,  G06F2203/04112 ,  G06K9/00013

Abstract: A touch panel with fingerprint recognition comprises a glass substrate, an electrode layer, a first insulated layer, and a fingerprint recognition sensing layer. The glass substrate has a first plane and a second plane. The electrode layer is disposed on the second plane and has plural first electrodes, plural second electrodes, and plural metal traces. The first electrodes and the second electrodes are selectively electrically connected to the metal traces. The first insulated layer covers an overlapping of the first electrodes and the second electrodes. The fingerprint recognition sensing layer is disposed on the first plane and has plural fingerprint recognition chips and plural transmission lines. The fingerprint recognition chips are electrically connected to the transmission lines. By means of the integration of the fingerprint recognition chips and the touch panel, the whole manufacturing cost is greatly decreased and the accuracy of fingerprint recognition is improved.

Abstract translation: 具有指纹识别的触摸面板包括玻璃基板，电极层，第一绝缘层和指纹识别感测层。 玻璃基板具有第一平面和第二平面。 电极层设置在第二平面上，具有多个第一电极，多个第二电极和多个金属迹线。 第一电极和第二电极选择性地电连接到金属迹线。 第一绝缘层覆盖第一电极和第二电极的重叠。 指纹识别感测层设置在第一平面上，具有多个指纹识别芯片和多个传输线。 指纹识别芯片电连接到传输线。 通过指纹识别芯片和触摸屏的集成，整体制造成本大大降低，提高了指纹识别的准确性。

公开(公告)号：US09110548B2

公开(公告)日：2015-08-18

申请号：US13760059

申请日：2013-02-06

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: G06F3/045 ,  G06F3/044

CPC classification number: G06F3/044 ,  G06F2203/04107

Abstract: A touch module includes a transparent substrate, a shield layer, a touch electrode layer, a transparent insulation layer and a lead layer. The shield layer is coated on the transparent substrate. The touch electrode layer is coated on both the transparent substrate and the shield layer. The transparent insulation layer is disposed on the touch electrode layer and formed with at least one through hole. The lead layer is disposed on the transparent insulation layer and formed with a conduction section positioned in the through hole in electrical connection with the touch electrode layer. Therefore, the lead layer can directly electrically connect with the touch electrode layer through the through hole of the transparent insulation layer. Accordingly, the cost for the optical mask design and the lithographic and etching processes can be saved and the problem that the transparent substrates often fail to fully attach is eliminated.

Abstract translation: 触摸模块包括透明基板，屏蔽层，触摸电极层，透明绝缘层和引线层。 屏蔽层涂覆在透明基板上。 触摸电极层涂覆在透明基板和屏蔽层两者上。 透明绝缘层设置在触摸电极层上并形成有至少一个通孔。 引线层设置在透明绝缘层上，并且形成有与触摸电极层电连接的位于通孔中的导电部分。 因此，引线层可以通过透明绝缘层的通孔与触摸电极层直接电连接。 因此，可以节省光学掩模设计和光刻和蚀刻工艺的成本，并且消除了透明基板经常不能完全附着的问题。

公开(公告)号：US20150138100A1

公开(公告)日：2015-05-21

申请号：US14085219

申请日：2013-11-20

Applicant: Chih-Chung Lin

Inventor： Chih-Chung Lin

IPC: G06F1/26 ,  G06F3/041

CPC classification number: G06F3/047 ,  G06F1/26 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04107 ,  G09G5/003 ,  G09G2300/04 ,  G09G2300/0404 ,  G09G2330/00 ,  H01L31/04 ,  Y02E10/50

Abstract: A touch module with photoelectric conversion layer includes a transparent substrate, an anti-reflection layer, a shield layer, a first electrode layer, a first insulation layer, a second electrode layer, a second insulation layer, a wiring layer, a protection layer and a photoelectric conversion layer. The transparent substrate is defined with a touch section and a non-touch section. The photoelectric conversion layer is disposed in the touch section so that the total thickness of the touch module is reduced. Moreover, the photoelectric conversion layer is combined with the touch module to convert optical energy into electrical energy and provide the electrical energy for the touch module. Accordingly, the standby and use time of the touch module is prolonged.

公开(公告)号：US20150091764A1

公开(公告)日：2015-04-02

申请号：US14503420

申请日：2014-10-01

Applicant: Yi-Ting Hsieh ,  Saou-Wen Su ,  Chih-Chung Lin

Inventor： Yi-Ting Hsieh ,  Saou-Wen Su ,  Chih-Chung Lin

IPC: H01Q1/27 ,  H01Q5/00 ,  H01Q7/00

CPC classification number: H01Q1/273 ,  H01Q5/364 ,  H01Q7/00

Abstract: A wearable electronic device includes a body and a wearing element. The body includes a conductive frame. The conductive frame includes a feeding point and at least one grounding point to form a first current path and a second current path. Furthermore, the conductive frame forms a loop antenna via the first current path and the second current path, respectively, so as to operate in a first band and a second band. The wearing element is connected to the body.

Abstract translation: 可穿戴电子装置包括主体和磨损元件。 主体包括导电框架。 导电框架包括馈电点和至少一个接地点以形成第一电流路径和第二电流路径。 此外，导电框架分别经由第一电流路径和第二电流路径形成环形天线，以便在第一频带和第二频带中操作。 磨损元件与身体连接。