公开(公告)号：US20110115088A1

公开(公告)日：2011-05-19

申请号：US12621569

申请日：2009-11-19

Applicant: Ching-Yu Lo ,  Bo-Jiun Lin ,  Hai-Ching Chen ,  Tien-I Bao ,  Shau-Lin Shue ,  Chen-Hua Yu

Inventor： Ching-Yu Lo ,  Bo-Jiun Lin ,  Hai-Ching Chen ,  Tien-I Bao ,  Shau-Lin Shue ,  Chen-Hua Yu

IPC: H01L23/48

CPC classification number: H01L23/53295 ,  H01L23/5329 ,  H01L24/02 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00

Abstract: An integrated circuit device has a dual damascene structure including a lower via portion and an upper line portion. The lower via portion is formed in a polyimide layer, and the upper line portion is formed in an inter-metal dielectric (IMD) layer formed of USG or polyimide. A passivation layer is formed on the IMD layer, and a bond pad is formed overlying the passivation layer to electrically connect the upper line portion.

Abstract translation: 集成电路装置具有双镶嵌结构，其包括下通孔部分和上线部分。 下通孔部分形成在聚酰亚胺层中，并且上部分部分形成在由USG或聚酰亚胺形成的金属间电介质（IMD）层中。 在IMD层上形成钝化层，并且形成覆盖钝化层的接合焊盘以电连接上部线部分。

公开(公告)号：US20080074065A1

公开(公告)日：2008-03-27

申请号：US11636492

申请日：2006-12-11

Applicant: Ching-Yu Lo

Inventor： Ching-Yu Lo

IPC: H02P7/00

CPC classification number: F04D25/166

Abstract: A complex signal processing system for multiple fans is used to control the rotation of a first fan and a second fan. The speed signals of the first fan and the second fan are processed through an XOR operation to obtain a complex speed signal. In response to the complex speed signal, the speed and the operational status of the first fan and the second fan can be evaluated.

Abstract translation: 用于多个风扇的复杂信号处理系统用于控制第一风扇和第二风扇的旋转。 通过异或运算来处理第一风扇和第二风扇的速度信号以获得复合速度信号。 响应于复合速度信号，可以评估第一风扇和第二风扇的速度和操作状态。