摘要:
Embodiments of the present invention are directed to modular optical devices compatible with multiple fiber connectors. A lens block is configured such that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package that includes light transmitting and/or detecting components. At least one lens pin has a fiber stop configured to accept a fiber end prepared for use with a first type of fiber connector. A fiber stop disk alters the configuration of the lens pin such that the lens pin can compatibly accept a fiber end prepared for use with a second different type of fiber connector not withstanding that the fiber stop is configured to accept a fiber end prepared for use with the first type of fiber connector.
摘要:
This disclosure is generally concerned with optical modules. In one example, an optical module provided that includes a pair of optical subassemblies, each of which includes a port housing within which a corresponding optical component is disposed. The optical module further includes a pair of electrically conductive elements configured to facilitate control of EMI. Each of the electrically conductive elements is disposed on a respective port housing such that a gap is present between the first and second electrically conductive elements and the first and second electrically conductive elements do not contact each other.
摘要:
This disclosure is generally concerned with optical modules. In one example, an optical module provided that includes a pair of optical subassemblies, each of which includes a port housing within which a corresponding optical component is disposed. The optical module further includes a pair of electrically conductive elements configured to facilitate control of EMI. Each of the electrically conductive elements is disposed on a respective port housing such that a gap is present between the first and second electrically conductive elements and the first and second electrically conductive elements do not contact each other.
摘要:
An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.
摘要:
The present invention relates to modular optical devices compatible with legacy form factors, for example, SFF, SFP, and XFP form factors. A housing contains optical components including a lens block, a fabricated package, at least one lens pin, and a substrate. The lens block is configured to receive one or more lens pins. The fabricated package is mechanically coupled to the lens block and includes a light source and/or a light detector and a connector for coupling the fabricated package to the substrate. The at least one lens pin is mechanically coupled to the lens block for directing optical signals between the light source and/or light detector and external components. The substrate is mechanically coupled to the fabricated package and the housing and electrically connected to the light source and/or light detector such that substrate circuitry can electrically interoperate with the light source and/or light detector.
摘要:
Embodiments of the present invention are directed to a modular optical device for sending and/or receiving optical signals. A lens block is configured to mechanically couple to one or more lens pins and to a molded package. A molded package, including at least one of a light source and a light detector and including a connection portion manufactured for direct mechanical and electrical coupling of the molded package to a substrate, is mechanically coupled to the lens block. At least one lens pin for directing an optical signal between a light source or light detector and corresponding external components is coupled to the lens block. The modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
摘要:
The principles of the present invention provide for a plastic ROSA that has a metallic EMI shroud covering a portion of the plastic ROSA. The combination of the plastic ROSA and the EMI shroud provides the unexpected result of having EMI shielding substantially similar to a metal ROSA.
摘要:
Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.
摘要:
Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
摘要:
Embodiments of the present invention are directed to a modular optical device with a component insert for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or the light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts for electrical interoperation with the light source and/or the light detector to transfer optical signals. The modular optical device can be coupled to a substrate configured to be received within a standard host system slot.